Abstract: A heat exchanger for a chip package is provided. The heat exchanger includes a body having an upper side, a lower side, and an internal cavity disposed in the body between the upper side and the lower side. A first outlet port and a second outlet port are formed in the body and are in fluid communication with the internal cavity. An inlet port is formed through the upper side of the body between the first and second outlet ports to supply fluid into the internal cavity.

Abstract: In one example, a micro device includes a housing; a chip package disposed in the housing; a noise producing component coupled to the housing. The micro device also includes a noise reduction system having a reference microphone for detecting a noise from the noise producing component and a controller configured to receive the noise from the reference microphone and generate a masking sound signal in response to the detected noise. A speaker is coupled to the housing for producing a masking sound corresponding to the masking sound signal, whereby the masking sound reduces the noise. In another example, the noise producing component comprises a fan.

Abstract: A heat exchanger for a chip package is provided. The heat exchanger includes a body having an upper side, a lower side, and an internal cavity disposed in the body between the upper side and the lower side. A first outlet port and a second outlet port are formed in the body and are in fluid communication with the internal cavity. An inlet port is formed through the upper side of the body between the first and second outlet ports to supply fluid into the internal cavity.

Abstract: A chip package includes a substrate and an integrated circuit (“IC”) die mounted to the substrate. A stiffener frame is mounted to the substrate and circumscribes the IC die. The stiffener frame has a plurality of connected walls that define an opening in the stiffener frame. The chip package also includes a lid having a bottom side facing a top surface of the IC die. The lid has at least a first guide and a second guide extending from the bottom side of the lid. The first guide can be disposed outward or inward of the stiffener frame. The first guide has a side facing an outer wall surface or an inner wall surface of the stiffener frame. The first guide and the second guide are positioned to limit movement of the lid relative to the stiffener frame in two directions.

Abstract: An external module is for use with a designated computing device. The external module includes a body forming a hollow chamber. An external air intake formed in the body and connected to a first portal of the chamber. An air outlet formed in the body along a wall of the chamber and adapted to align with a cooling air intake of the designated computing device when the external module is positioned in a designated relationship to the computing device. A blower is positioned to force air through the external air intake into the chamber and maintain a positive air pressure in the chamber such that the positive air pressure is maintained against at least part of the cooling air intake of the computing device when the air outlet is aligned with the cooling air intake.

Abstract: Various modular thermal management systems for a computing device and methods of using the same are disclosed. In one aspect, a method of providing thermal management for a heat generating component is provided. The method includes placing a heat sink in thermal contact with the heat generating component and coupling a shroud to the heat sink. The shroud has a first opening to direct air in a first direction past the heat sink and a second opening to direct air in a second direction past the heat sink. Air is moved through the first opening or the second opening.

Abstract: Various modular thermal management systems for a computing device and methods of using the same are disclosed. In one aspect, a method of providing thermal management for a heat generating component is provided. The method includes placing a heat sink in thermal contact with the heat generating component and coupling a shroud to the heat sink. The shroud has a first opening to direct air in a first direction past the heat sink and a second opening to direct air in a second direction past the heat sink. Air is moved through the first opening or the second opening.

Abstract: Various portable computing device thermal management stands and methods of using and making the same are disclosed. In one aspect, a stand for supporting and thermally managing a portable computing device that has a first surface is provided. The stand includes a support plate that has a second surface to contact the first surface of the computing device and transfer heat from the computing device by conduction. The stand is operable to transfer heat received from the computing device to the ambient environment. A wall coupled to the support plate may be used to bear against a member supporting the stand to provide stability.

Abstract: A device comprising a first thermal interface material, and a first micro-channel cold plate. The first thermal interface material is in physical communication with a first plurality of memory modules of a computer system. The first micro-channel cold plate is in physical communication with the first thermal interface material. The first micro-channel cold plate is adapted to allow a fluid flow through a first plurality of micro-channels, and configured to remove a first amount of heat produced by the first memory modules of the computer system through the first thermal interface material.