Patents by Inventor Christopher James Healy

Christopher James Healy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing tight pitch, flip chip integrated circuit packages
    Patent number: 8371497
    Abstract: A flip chip packaging method to attach a die to a package substrate, the method including dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package substrate. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: February 12, 2013
    Assignee: QUALCOMM Incorporated
    Inventor: Christopher James Healy
  • Method for Manufacturing Tight Pitch, Flip Chip Integrated Circuit Packages
    Publication number: 20100314433
    Abstract: A flip chip packaging method to attach a die to a package substrate, the method including dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package substrate. Other embodiments are described and claimed.
    Type: Application
    Filed: June 11, 2009
    Publication date: December 16, 2010
    Applicant: QUALCOMM INCORPORATED
    Inventor: Christopher James Healy