Patents by Inventor Christopher John Berry

Christopher John Berry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafers including patterned back side layers thereon
    Patent number: 8643177
    Abstract: A method of processing a wafer including a plurality of integrated circuit devices on a front side of the wafer, may include thinning the wafer from a back side opposite the front side. After thinning the wafer, a back side layer may be provided on the back side of the thinned wafer opposite the front side, and the back side layer may be configured to counter stress on the front side of the wafer including the plurality of integrated circuit devices thereon. After providing the back side layer, the plurality of integrated circuit devices may be separated. Related structures are also discussed.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: February 4, 2014
    Assignee: Amkor Technology, Inc.
    Inventors: Glenn A. Rinne, Kevin Engel, Julia Roe, Christopher John Berry
  • Direct-write wafer level chip scale package
    Patent number: 8501543
    Abstract: A method and structure provides a Direct Write Wafer Level Chip Scale Package (DWWLCSP) that utilizes permanent layers/coatings and direct write techniques to pattern these layers/coatings, thereby avoiding the use of photoimagable materials and photo-etching processes.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: August 6, 2013
    Assignee: Amkor Technology, Inc.
    Inventors: Christopher John Berry, Ronald Patrick Huemoeller, David Jon Hiner
  • Direct-write wafer level chip scale package
    Patent number: 8188584
    Abstract: A method and structure provides a Direct Write Wafer Level Chip Scale Package (DWWLCSP) that utilizes permanent layers/coatings and direct write techniques to pattern these layers/coatings, thereby avoiding the use of photoimagable materials and photo-etching processes.
    Type: Grant
    Filed: March 19, 2010
    Date of Patent: May 29, 2012
    Assignee: Amkor Technology, Inc.
    Inventors: Christopher John Berry, Ronald Patrick Huemoeller, David Jon Hiner
  • Direct-write wafer level chip scale package
    Patent number: 7723210
    Abstract: A method and structure provides a Direct Write Wafer Level Chip Scale Package (DWWLCSP) that utilizes permanent layers/coatings and direct write techniques to pattern these layers/coatings, thereby avoiding the use of photoimagable materials and photo-etching processes.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: May 25, 2010
    Assignee: Amkor Technology, Inc.
    Inventors: Christopher John Berry, Ronald Patrick Huemoeller, David Jon Hiner