Patents by Inventor Christopher John Nash

Christopher John Nash has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Voiding control using solid solder preforms embedded in solder paste
    Patent number: 10537030
    Abstract: Methods are provided for controlling voiding caused by gasses in solder joints of electronic assemblies. In various embodiments, a preform can be embedded into the solder paste prior to the component placement. The solder preform can be configured with a geometry such that it creates a standoff, or gap, between the components to be mounted in the solder paste. The method includes receiving a printed circuit board comprising a plurality of contact pads; depositing a volume of solder paste onto each of the plurality of contact pads; depositing a solder preform into each volume of solder paste; placing electronic components onto the printed circuit board such that contacts of the electronic components are aligned with corresponding contact pads of the printed circuit board; and reflow soldering the electronic components to the printed circuit board.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: January 14, 2020
    Assignee: INDIUM CORPORATION
    Inventors: Zhenxi Wei, Lei Luo, Christopher John Nash, Derrick Matthew Herron
  • VOIDING CONTROL USING SOLID SOLDER PREFORMS EMBEDDED IN SOLDER PASTE
    Publication number: 20160057869
    Abstract: Methods are provided for controlling voiding caused by gasses in solder joints of electronic assemblies. In various embodiments, a preform can be embedded into the solder paste prior to the component placement. The solder preform can be configured with a geometry such that it creates a standoff, or gap, between the components to be mounted in the solder paste. The method includes receiving a printed circuit board comprising a plurality of contact pads; depositing a volume of solder paste onto each of the plurality of contact pads; depositing a solder preform into each volume of solder paste; placing electronic components onto the printed circuit board such that contacts of the electronic components are aligned with corresponding contact pads of the printed circuit board; and reflow soldering the electronic components to the printed circuit board.
    Type: Application
    Filed: August 24, 2015
    Publication date: February 25, 2016
    Applicant: Indium Corporation
    Inventors: Zhenxi Wei, Lei Luo, Christopher John Nash, Derrick Matthew Herron