Patents by Inventor Christopher K. Lindsey

Christopher K. Lindsey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for breaking a semiconductor wafer or other workpiece along a scribe line
    Patent number: 8220685
    Abstract: Apparatus and method for breaking a scribed semiconductor wafer utilizes two vacuum chucks, at least one of the vacuum chucks pivotable about a pivot line. The scribe line is aligned with the pivot line and relative movement between the vacuum chucks causes bending forces to be applied to the wafer and breakage of the wafer along the scribe line.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: July 17, 2012
    Assignee: Micro Processing Technology, Inc.
    Inventors: Paul C. Lindsey, Jr., Christopher K. Lindsey, Jeffery D. Atkinson
  • Scribing tool and method
    Patent number: 7392732
    Abstract: A scribing tool for use in semiconductor scribing apparatus includes a rotatable semiconductor wafer scribing wheel engageable with the semiconductor wafer to form a scribe line when the tool exerts pressure on the semiconductor wafer and the scribing wheel rotates. Bearings are engageable with the scribing wheel sides to resist sideways deflection during the scribing operation.
    Type: Grant
    Filed: January 24, 2005
    Date of Patent: July 1, 2008
    Assignee: Micro Processing Technology, Inc.
    Inventors: Paul C. Lindsey, Jr., Christopher K. Lindsey, Jeffery D. Atkinson