Abstract: A circuit pack housing for providing EMI protection for a circuit pack which may be inserted into an electronics system such as a telecommunications base station cabinet. The circuit pack housing has a single piece plastic design which surrounds the enclosed circuit pack. The internal walls of the circuit pack housing are metalized, and the inner surface of the housing comprises one or more grounding tabs with metalized surfaces. The metalized plastic circuit pack housing also comprises two opposite living hinges and a self latching mechanism, such that when the circuit pack is placed inside the housing and the housing is closed on itself (i.e., with use of the living hinges), the circuit pack is sealed within the housing and protected from EMI thereby. Moreover, the housing may include protruding flexible tabs at the ends thereof, which advantageously seals around the connector which energizes the circuit pack.

Abstract: An electronics system is implemented within a compact enclosure comprising two or more hinged layers. The functionality corresponding to a shelf of a conventional cabinet resides in a corresponding layer. Backplanes are eliminated, each layer having contact surfaces that mate with matching surfaces of adjacent layers when the layers are rotated about their hinges into the closed configuration. Additional interconnection may be made through cabling housed within a special channel or compartment. Each layer may include cooling fans, which are smaller than conventional counterparts (due to shorter convection paths). Expansion may be effectuated by mating additional units of similar conformation in a modular fashion. Optionally, the functionality corresponding to a given layer may be implemented in circuitry integrated onto a single board to reduce cabling and facilitate replacement and repair. Additional functional layers may be stacked along the depth direction as well as the height or width direction.

Abstract: Techniques for determining how to translate forecast sales data of at least one configuration of assembled product into a forecast schedule of subcomponents composing the assembled product is described. To this end, forecast sales data of at least one configuration of assembled product is received. Usage factors of a plurality of subcomponents composing the assembled product are also received. Each usage factor corresponds to the at least one configuration of assembled product. The forecast schedule of subcomponents composing the assembled product is then composed by applying the usage factors of the plurality of subcomponents to the forecast sales data of at least one configuration of assembled product wherein the forecast schedule includes demand for the subcomponents over time.