Patents by Inventor Christopher Katzko

Christopher Katzko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component carrier with component embedded in cavity and with double dielectric layer on front side
    Patent number: 11160169
    Abstract: A component carrier includes a base structure with component carrier material and forming a cavity, a component embedded in the cavity, a first electrically insulating layer structure connected to a front side of the base structure and to the component and at least partially filling a gap between the component and the base structure, and a second electrically insulating layer structure connected to the first electrically insulating layer structure at a connection surface of the first electrically insulating layer structure. The connection surface opposes an opposing surface of the second electrically insulating layer structure faces away from the first electrically insulating layer structure.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: October 26, 2021
    Assignee: AT&S (Chongqing) Company Limited
    Inventors: Yu-Hui Wu, Christopher Katzko
  • Component Carrier With Component Embedded in Cavity and With Double Dielectric Layer on Front Side
    Publication number: 20200045825
    Abstract: A component carrier includes a base structure with component carrier material and forming a cavity, a component embedded in the cavity, a first electrically insulating layer structure connected to a front side of the base structure and to the component and at least partially filling a gap between the component and the base structure, and a second electrically insulating layer structure connected to the first electrically insulating layer structure at a connection surface of the first electrically insulating layer structure. The connection surface opposes an opposing surface of the second electrically insulating layer structure faces away from the first electrically insulating layer structure.
    Type: Application
    Filed: August 1, 2019
    Publication date: February 6, 2020
    Inventors: Yu-Hui Wu, Christopher Katzko