Abstract: A housing cap for an electronics component includes a main body with an opening which is closed by a window. The window is connected to the main body using a compensation element, wherein there is an integral connection using a first connection material between the compensation element and the window and there is an integral connection using a second connection material between the compensation element and the main body, wherein a first coefficient of thermal expansion of the window is adapted to a second coefficient of thermal expansion of the compensation element or the first coefficient of thermal expansion is lower than the second coefficient of thermal expansion.

Abstract: A multilaser arrangement includes: a housing including a base plate, a housing cap fastened on the base plate, and a transparent element, the base plate including a bottom face, the housing cap including an opening with the transparent element assigned to the opening for the passage of electromagnetic radiation; lasers, each being arranged inside the housing at a distance from the bottom face of the base plate, the housing cap including an upper wall and a side wall, which includes a lower edge and a surface, is formed integrally with the upper wall, and ends with the lower edge fastened on the base plate, the side wall having a first thickness and a second thickness, the first thickness being measured in a direction perpendicular to the surface, the second thickness being measured at the lower edge and being less than or equal to the first thickness.