Abstract: A sauna includes a plurality of side walls, a floor, and a ceiling. A heat emitter assembly is coupled to at least one of the plurality of side walls, the floor, or the ceiling. A buffer wall is positioned in front of the heat emitter assembly, wherein at least a portion of the heat emitter assembly is exposed through an opening in the buffer wall. In some embodiments, the heater emitter assembly comprises a plurality of carbon, fiber, ceramic, or a combination of carbon-ceramic, infra-red emitter units coupled to at least one of the plurality of side walls, the floor, or the ceiling. A buffer wall comprising a plurality of wooden slats, is positioned proximate the infra-red emitter units. The wooden slats and the infra-red emitter units are arranged in an alternating order, exposing the infra-red emitter units between openings defined by adjacent wooden slats in the buffer wall.

Abstract: A chipper device for chipping one or more metal ingots. The chipper device includes a cutter head and a guide mechanism associated with the cutter head. The guide mechanism includes a chute having a passageway. A feed mechanism is adapted to move one or more ingots sequentially through the passageway of the chute into engagement with the cutter head, whereby the cutter head chips the ingots into a plurality of particles.

Abstract: A chipper device for chipping one or more metal ingots. The chipper device includes a cutter head and a guide mechanism associated with the cutter head. The guide mechanism includes a chute having a passageway. A feed mechanism is adapted to move one or more ingots sequentially through the passageway of the chute into engagement with the cutter head, whereby the cutter head chips the ingots into a plurality of particles.