Patents by Inventor Christopher KLEMENT

Christopher KLEMENT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through-silicon via layout for multi-die integrated circuits
    Patent number: 12107076
    Abstract: Integrated circuits and integrated circuit dies include TSVs laid out in symmetrical patterns. Because of the symmetrical arrangement of the TSVs and associated routing patterns, an integrated circuit is able to support operation of multiple similar dies that are placed in different positions in the integrated circuit. This in turn simplifies the design and production of the multiple similar dies, thus reducing development and manufacturing costs for the corresponding integrated circuits.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: October 1, 2024
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Wonjun Jung, Jasmeet Singh Narang, Tyrone Huang, Christopher Klement, Alan D. Smith, Edward Chang, John Wuu
  • THROUGH-SILICON VIA LAYOUT FOR MULTI-DIE INTEGRATED CIRCUITS
    Publication number: 20230207527
    Abstract: Integrated circuits and integrated circuit dies include TSVs laid out in symmetrical patterns. Because of the symmetrical arrangement of the TSVs and associated routing patterns, an integrated circuit is able to support operation of multiple similar dies that are placed in different positions in the integrated circuit. This in turn simplifies the design and production of the multiple similar dies, thus reducing development and manufacturing costs for the corresponding integrated circuits.
    Type: Application
    Filed: December 28, 2021
    Publication date: June 29, 2023
    Inventors: Wonjun JUNG, Jasmeet SINGH NARANG, Tyrone HUANG, Christopher KLEMENT, Alan D. SMITH, Edward CHANG, John WUU