Abstract: A method for soldering or hybridizing two components to each other by means of a solder material, including producing, on the opposite-facing surfaces of the components to be soldered or hybridized, a surface capable of being wetted by said solder material, this surface being produced on a first component which is in electrical contact with a metallic conductor, depositing an appropriate quantity of solder material capable of constituting a solder or hybridization pad on one of the wettability surfaces, depositing a flux material in liquid form, bringing the wettability surface of the other component into contact with the solder material thus deposited and raising the temperature until at least the melting temperature of the solder material is reached in order to ensure effective soldering or hybridization of the two components to each other due to the reflow effect.

Abstract: A hermetic coupling device between an optoelectronic component emitting and/or receiving a light beam, and an optical transmission mechanism conveying the light beam. The hermetic coupling device includes a substrate including a blind hole, having a bottom wall, into which one part of the optical transmission mechanism is inserted. The substrate is formed of a stack of a first layer and a second layer. The light beam crosses the substrate passing through the bottom wall of the blind hole, the substrate receiving the optoelectronic component substantially opposite the blind hole. Reflective patterns are inserted between two layers of the hermetic coupling device, substantially on the periphery of the blind hole, and reflect one part of the light beam emitted by the optoelectronic component.

Abstract: A power connector for mating with a bus bar includes a conductive support structure defining at least a first slot, an electrical contact positioned within the first slot, and a biasing pin positioned within the first slot and engaging the electrical contact. The biasing pin biases at least a first portion of the electrical contact against the conductive support structure to maintain electrical conductivity between the conductive support structure and the electrical contact. At least a second portion of the electrical contact engages a bus bar when the bus bar is received in the first slot.

Abstract: This relates to an opto-electronic device comprising at least two opto-electronic components (1, 2) which work together, including a first one that is a surface light emitting laser (1) and another opto-electronic component (2). Each of the opto-electronic components (1, 2) is mounted on a main face (3.1, 3.2) that is different and opposite an intermediate layer (3) incorporating a grating coupler (5) coupled to an optical wave guide (4) designed to transport part of the light emitted by the surface emitting laser (1). The grating coupler (5) is sandwiched between the emissive face of the surface emitting laser (1) and the other opto-electronic component (2).

Abstract: The disclosure relates to an optical device comprising an assembly and optical coupling cover between at least one waveguide integrated onto a first support and at least one optical fibre integrated onto a fibre connector, wherein the cover is capable of being fixed to the first support and comprises: one or several grooves designed to allow to the cover to nest with the connection pins of the optical fibre connector, at least one other groove equipped with longitudinal sides, a base, and a wall forming an angle that is not nil with the base and the sides, wherein said other groove is designed to be positioned in the extension of the optical axis of the fibre and so that said wall is located opposite the fibre, an optical system positioned at the level of a wall of said other groove, capable of deviating towards the fibre a luminous beam from the wave guide and/or deviating towards the wave guide a luminous beam from the optical fibre.

Abstract: An optoelectronic transmitting and receiving device, including a pierced platform including at least one through hole for introduction of an optical fiber, a first optoelectronic element integral with the platform, arranged substantially facing the through hole and configured to emit or receive a first laser beam at a first wavelength, and at least one second optoelectronic element hybridized on the platform and arranged substantially facing the through hole. The first element is arranged between the platform and the second element, which is configured to receive or emit a second laser beam at a second wavelength, different than the first wavelength, passing through the first element.

Abstract: A hermetic coupling device between an optoelectronic component emitting and/or receiving a light beam, and an optical transmission mechanism conveying the light beam. The hermetic coupling device includes a substrate including a blind hole, having a bottom wall, into which one part of the optical transmission mechanism is inserted. The substrate is formed of a stack of a first layer and a second layer. The light beam crosses the substrate passing through the bottom wall of the blind hole, the substrate receiving the optoelectronic component substantially opposite the blind hole. Reflective patterns are inserted between two layers of the hermetic coupling device, substantially on the periphery of the blind hole, and reflect one part of the light beam emitted by the optoelectronic component.

Abstract: A retaining system is provided for removably retaining portable objects to a carrier object. Three or more connection elements are defined on a base surface of the carrier object and spaced apart therealong. A flexible member is connectable to different ones of the connection elements to form a loop defined between the base surface and a portion of the flexible member spaced therefrom and extending between two connection elements to which the flexible member is connected. The ability to attach the flexible member to different ones of the connection elements facilitates adjustment of the position, orientation or dimension along the base surface of a loop or the number of loops defined by the flexible member for securing one or more portable objects to the carrier object.

Abstract: An optical system with an optical beam propagation extension, having an input and an output for the optical beam. The system includes at least two optical reflection elements for reflection of the beam, arranged to extend the propagation of the beam by reflection on the reflection elements, and at least one optical beam transmission element arranged to be traversed at least twice by the optical beam in different directions during propagation of the optical beam in the optical system. The optical transmission element ensures an optical transformation of the optical beam each tim the optical beam passes through so as to correct the divergence thereof.

Abstract: The optical device comprises a first and a second optical sources respectively emitting a first incident beam and a second light beam of different wavelength. Reflecting means, which may be a mirror, are arranged on the optical path of the first incident beam so as to form a reflected light beam. The reflecting means are arranged outside and proximate to the optical path of the second light beam so that the reflected beam and the second light beam pass through a zone of the space, wherein an object to be analyzed is to be exposed, and reach a common sensor.

Abstract: This assembly of an object and a support is achieved by using solder bumps. At least two wettability areas are made respectively on object and on support. Each solder bump ensures electrical contact and mechanical fixing firstly to one of the wettability areas of object and secondly to one of the wettability areas of support. The melting temperature of solder bumps is lower than the melting temperature of each of the wettability areas. Each wettability area of object forms an angle of 70° to 110° with respect to each wettability area of support. Object and support are mutually distant.

Abstract: An optical component to be mounted on a transfer surface. At least one face of the optical component includes at least one metallized bonding land arranged in a notch for assembly by transfer of the component and soldering of metallized bonding lands on the transfer surface.

Abstract: The invention concerns a photolithography fabrication method enabling production of patterns in a photosensitive resin layer (601) placed on a substrate (600). The patterns (607) comprise flanks (608) inclined relative to a normal ({right arrow over (n)}) relative to the principal plane of the substrate and which have an angle of inclination (?) far greater to that of the patterns obtained according to the prior art. The invention also concerns a device allowing said method to be executed.

Abstract: A process for assembly of different elements making up a microtechnological device is described. The assembly process comprises attachment of the two elements together by magnetic interaction of means that are made in the elements. Preferably, assembly and attachment are followed by an alignment of the elements due to magnetic interaction between the means. Alignment may be passive or dynamic, due particularly to the presence of a matrix of electromagnets in at least one of the means.

Abstract: The optical device comprises a first and a second optical sources (7,8) respectively emitting a first incident beam (10) and a second light beam (11) of different wavelength. Reflecting means, which may be a mirror (15), are arranged on the optical path of the first incident beam (10) so as to form a reflected light beam (12). The reflecting means are arranged proximate to the optical path of the second light beam (11) so that the reflected beam (12) and the second light beam (11) pass through a zone of the space (14), wherein an object to be analyzed is to be exposed, and reach a common sensor (13).