Abstract: A method and system for polishing a plurality of workpieces is disclosed. The method and system comprises providing a polishing tool with multiple polishing heads; and providing a substrate tray that can hold the plurality of work pieces in a fixed position on a tray underneath the polishing heads. The system and method includes moving the tray within the polisher. Finally, the method and system includes configuring the multiple polishing heads with the appropriate pad/slurry combinations to polish the workpieces and to create a finished polished surface on the plurality of work pieces.

Abstract: A method and system provide a storage device. A plurality of read sensor stacks for each reader of the storage device are provided. The read sensor stacks are distributed along a down track direction and offset in a cross-track direction. A plurality of electronic lapping guides (ELGs) are provided for the read sensor stacks. The read sensor stacks are lapped. Lapping is terminated based on signal(s) from the ELG(s).

Abstract: A method and system provide a storage device. A plurality of read sensor stacks for each reader of the storage device are provided. The read sensor stacks are distributed along a down track direction and offset in a cross-track direction. A plurality of electronic lapping guides (ELGs) are provided for the read sensor stacks. The read sensor stacks are lapped. Lapping is terminated based on signal(s) from the ELG(s).

Abstract: A method and system for polishing a plurality of workpieces is disclosed. The method and system comprises providing a polishing tool with multiple polishing heads; and providing a substrate tray that can hold the plurality of work pieces in a fixed position on a tray underneath the polishing heads. The system and method includes moving the tray within the polisher. Finally, the method and system includes configuring the multiple polishing heads with the appropriate pad/slurry combinations to polish the workpieces and to create a finished polished surface on the plurality of work pieces.

Abstract: A method and system provide a storage device. A plurality of read sensor stacks for each reader of the storage device are provided. The read sensor stacks are distributed along a down track direction and offset in a cross-track direction. A plurality of electronic lapping guides (ELGs) are provided for the read sensor stacks. The read sensor stacks are lapped. Lapping is terminated based on signal(s) from the ELG(s).

Abstract: A method and system for polishing a plurality of workpieces is disclosed. The method and system comprises providing a polishing tool with multiple polishing heads; and providing a substrate tray that can hold the plurality of work pieces in a fixed position on a tray underneath the polishing heads. The system and method includes moving the tray within the polisher. Finally, the method and system includes configuring the multiple polishing heads with the appropriate pad/slurry combinations to polish the workpieces and to create a finished polished surface on the plurality of work pieces.

Abstract: A method and system provide a storage device. A plurality of read sensor stacks for each reader of the storage device are provided. The read sensor stacks are distributed along a down track direction and offset in a cross-track direction. A plurality of electronic lapping guides (ELGs) are provided for the read sensor stacks. The read sensor stacks are lapped. Lapping is terminated based on signal(s) from the ELG(s).

Abstract: A method for providing a storage device that includes a plurality of read sensor stacks for each reader of the storage device. The plurality of read sensor stacks are distributed along a down track direction and offset in a cross-track direction. A plurality of electronic lapping guides (ELGs) are provided for the read sensor stacks. The read sensor stacks are lapped. Lapping is terminated based on signal(s) from the ELG(s).

Abstract: A magnetic read apparatus has a media-facing surface (MFS) and includes a read sensor, a magnetic bias structure and an insulating layer. The read sensor has a side, a front occupying part of the MFS and a back. The read sensor includes a free layer, a pinned layer and a barrier layer between the free and pinned layers. The barrier layer has a barrier layer coefficient of thermal expansion. The magnetic bias structure is adjacent to the side of the free layer. The insulating layer includes first and second portions. The first portion of the insulating layer is between the read sensor side and the magnetic bias structure. The second portion of the insulating layer adjoins the read sensor back. The insulating layer has an insulating layer coefficient of thermal expansion that is at least ? of and not more than 5/3 of the barrier layer coefficient of thermal expansion.

Abstract: A method of making a magnetic head is provided. The method includes forming a first read sensor and a first electrical contact formed with a first shunt region. The method further includes forming a first mid-shield layer on the first read sensor, the first mid-shield layer being electrically connected to the first electrical contact. Additionally the method also includes forming a second mid-shield layer over the first mid-shield layer. Further, the method also includes forming a second read sensor over the second mid-shield layer, the second read sensor having a second electrical contact formed with a second shunt region electrically connected to the first shunt region.

Abstract: A method of making a magnetic head is provided. The method includes forming a first read sensor and a first electrical contact formed with a first shunt region. The method further includes forming a first mid-shield layer on the first read sensor, the first mid-shield layer being electrically connected to the first electrical contact. Additionally the method also includes forming a second mid-shield layer over the first mid-shield layer. Further, the method also includes forming a second read sensor over the second mid-shield layer, the second read sensor having a second electrical contact formed with a second shunt region electrically connected to the first shunt region.

Abstract: A read transducer having a first read sensor, a second read sensor, and a first middle shield is provided. The second read sensor is disposed in a down track direction from the first read sensor. The first middle shield is disposed between the first read sensor and the second read sensor. The first middle shield includes a first metallic middle shield layer disposed between the first read sensor and the second read sensor, a second metallic middle shield layer disposed between the first metallic middle shield layer and the second read sensor, and a first magnetic-spacer layer disposed between the first metallic middle shield layer and the second metallic middle shield layer. The first metallic middle shield layer and the second metallic middle shield layer have substantially the same polarity.

Abstract: An apparatus adapted to detect a particle present on a bevel of a wafer. The apparatus includes a substrate support and a sensor housing adapted to receive an edge of the wafer. The sensor housing includes one or more probe electrodes and one or more position sensors. The apparatus also includes a translatable stage coupled to the sensor housing. The translatable stage is adapted to control the distance between the bevel of the wafer and the one or more position sensors. The apparatus further includes electrical circuitry electrically coupled to the substrate support and the one or more probe electrodes and adapted to generate an electric field between the bevel of the wafer and the one or more probe electrodes, detection circuitry electrically coupled to the electrical circuitry, and a processor adapted to process electrical signals and thereby detect the particle present on the bevel of the wafer.

Abstract: A monitor device includes a substrate and a plurality of temperature sensors disposed in the substrate. The monitor device also includes a processor coupled to the substrate and adapted to receive one or more signals from the plurality of temperature sensors. The processor is further adapted to convert the one or more received signals into one or more converted signals. The monitor device further includes a transceiver coupled to the substrate and adapted to receive the one or more converted signals. The transceiver is further adapted to transmit one or more output signals to an external receiver.

Abstract: A monitor device includes a substrate and a plurality of temperature sensors disposed in the substrate. The monitor device also includes a processor coupled to the substrate and adapted to receive one or more signals from the plurality of temperature sensors. The processor is further adapted to convert the one or more received signals into one or more converted signals. The monitor device further includes a transceiver coupled to the substrate and adapted to receive the one or more converted signals. The transceiver is further adapted to transmit one or more output signals to an external receiver.