Abstract: According to the present invention, a screen printer (200) selectively applies solder paste to multiple types of printed circuit boards. The screen printer (200) includes mobile placement equipment (210), which receives and transports the boards, and application equipment, which includes first and second stencils (225), frames for holding the stencils (225) in fixed positions, and an applicator (415) for applying solder paste to a board through either the first or second stencil (225). A controller (215) determines the type of a board received by the mobile placement equipment (210), then, when the board is of a first type, directs the mobile placement equipment (210) to a location aligned with the first stencil. When the board is of a second type, the mobile placement equipment (210) is directed to a location aligned with the second stencil.

Abstract: A single screen printer (200) holds at least two solder stencils (225). The screen printer (200) receives a printed circuit board (105) and determines a printed circuit board configuration. When the printed circuit board (105) is of a first configuration, the printed circuit board (105) is aligned with a first stencil (225) and solder paste is selectively applied to the printed circuit board (105) through the first stencil (225). When the printed circuit board (105) is of a second configuration, the printed circuit board is aligned with a second stencil (225) through which solder paste is selectively applied to the printed circuit board (105).

Abstract: A robotic placement device (FIG. 1) comprises a programmable end-effector (200) for picking and placing component parts. The programmable end-effector (200) comprises a cylinder (201) having a piston (202) including a first (203) and second (208) shafts coupled together. The first shaft (203) of the piston is larger than the second shaft (208). A controller (102) controls a pressure applied to the cylinder (201) and the piston (202) including the first (203) and second (208) shafts of the programmable end-effector (200) establishes a predetermined placement force at the programmable end-effector (200) while placing component parts. A control circuit 118 senses the pressure and in response thereto generates a signal. A processor 108 coupled to the controller (102) processes the signal and in response thereto varying the pressure for maintaining a substantially constant placement force at the programmable end-effector (200) while the programmable end-effector (200) moves vertically.