Patents by Inventor Christopher L. Hayes

Christopher L. Hayes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7464360
    Abstract: A multi-level framework that allows an application to be developed independent of the chip or board, and any dependency is built in as part of the framework of the field programmable device (FPD). According to one embodiment, a field programmable device (FPD) comprises at least one hardware design language (HDL) application core with at least one component virtual interface respectively coupled to the HDL core, wherein the HDL core and the component virtual interface form a component, and wherein the component virtual interface has a plurality of pre-defined interfaces for communicating with the core. The component is hardware independent of the FPD. There is a target platform interface coupled to the component virtual interface wherein the target platform interface incorporates hardware specific information. A framework manager is coupled to the target platform interface and communicates with at least one operating system.
    Type: Grant
    Filed: March 21, 2006
    Date of Patent: December 9, 2008
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Kazem Haji-Aghajani, Christopher L Hayes
  • Patent number: 7017140
    Abstract: A multi-level framework that allows an application to be developed independent of the chip or board, and any dependency is built in as part of the framework of the field programmable device (FPD). A shell configuration called a ‘wrapper’ has a standard look, feel and form factor that provides the interface between the high density language (HDL) application and a standardized and board independent HDL shell, thus isolating the HDL core. A second wrapper is a board specific HDL shell that interacts with the standardized shell. Any application that has the same look, feel and form factor has a common interface that allows various system boards to communicate, providing a mechanism for creating a HDL application component independent of the hardware. An outer shell binds the system to some board and talks to the application program interface (API) layer and the code layer to the outside world, such as the operating system.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: March 21, 2006
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Kazem Haji-Aghajani, Christopher L. Hayes, Peter Simonson, Frank Stroili, Matthew Thiele, Robert P. Boland
  • Publication number: 20040045015
    Abstract: A multi-level framework that allows an application to be developed independent of the chip or board, and any dependency is built in as part of the framework of the field programmable device (FPD). A shell configuration called a ‘wrapper’ has a standard look, feel and form factor that provides the interface between the high density language (HDL) application and a standardized and board independent HDL shell, thus isolating the HDL core. A second wrapper is a board specific HDL shell that interacts with the standardized shell. Any application that has the same look, feel and form factor has a common interface that allows various system boards to communicate, providing a mechanism for creating a HDL application component independent of the hardware. An outer shell binds the system to some board and talks to the application program interface (API) layer and the code layer to the outside world, such as the operating system.
    Type: Application
    Filed: November 25, 2002
    Publication date: March 4, 2004
    Inventors: Kazem Haji-Aghajani, Christopher L. Hayes, Peter Simonson, Frank Stroili, Matthew Thiele, Robert P. Boland