Patents by Inventor Christopher L. Schutte

Christopher L. Schutte has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8663490
    Abstract: A semiconductor wafer handler comprises a ring (70) attached to a hub (80) by a plurality of spokes (90). Vacuum is applied to the surface of the semiconductor wafer through orifices (100) containing in the ring (70). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices (110) contained in the spokes (90).
    Type: Grant
    Filed: February 21, 2011
    Date of Patent: March 4, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Christopher L. Schutte, George T. Wallace
  • Publication number: 20110143540
    Abstract: A semiconductor wafer handler comprises a ring (70) attached to a hub (80) by a plurality of spokes (90). Vacuum is applied to the surface of the semiconductor wafer through orifices (100) containing in the ring (70). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices (110) contained in the spokes (90).
    Type: Application
    Filed: February 21, 2011
    Publication date: June 16, 2011
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Christopher L. Schutte, George T. Wallace
  • Patent number: 7914694
    Abstract: A semiconductor wafer handler comprises a ring (70) attached to a hub (80) by a plurality of spokes (90). Vacuum is applied to the surface of the semiconductor wafer through orifices (100) containing in the ring (70). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices (110) contained in the spokes (90).
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: March 29, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Christopher L. Schutte, George T. Wallace
  • Publication number: 20040173308
    Abstract: A semiconductor wafer handler comprises a ring (70) attached to a hub (80) by a plurality of spokes (90). Vacuum is applied to the surface of the semiconductor wafer through orifices (100) containing in the ring (70). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices (110) contained in the spokes (90).
    Type: Application
    Filed: March 16, 2004
    Publication date: September 9, 2004
    Inventors: Christopher L. Schutte, George T. Wallace
  • Publication number: 20040087263
    Abstract: A semiconductor wafer handler comprises a ring (70) attached to a hub (80) by a plurality of spokes (90). Vacuum is applied to the surface of the semiconductor wafer through orifices (100) containing in the ring (70). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices (110) contained in the spokes (90).
    Type: Application
    Filed: November 4, 2002
    Publication date: May 6, 2004
    Inventors: Christopher L. Schutte, George T. Wallace
  • Patent number: 6729947
    Abstract: A semiconductor wafer handler comprises a ring (70) attached to a hub (80) by a plurality of spokes (90). Vacuum is applied to the surface of the semiconductor wafer through orifices (100) containing in the ring (70). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices (110) contained in the spokes (90).
    Type: Grant
    Filed: November 4, 2002
    Date of Patent: May 4, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: Christopher L. Schutte, George T. Wallace