Patents by Inventor Christopher Lee Tessler
Christopher Lee Tessler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140192341Abstract: Methods for determining the planarity of two components of a semiconductor processing tool, such as a 3D wafer bonder are disclosed. The two components may be fixtures, chucks, or platens of the tool. A test wafer comprising multiple solder balls is compressed and the deformity of multiple solder balls is measured to assess the planarity of the tool. The measurement of the deformed solder balls may be performed manually, or with an automated wafer inspection tool, which may use lasers to measure the height of each solder ball. The planarity of the two components is computed based on the height of the deformed solder balls.Type: ApplicationFiled: January 7, 2013Publication date: July 10, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Sarah H. Knickerbocker, Jerry Allen Gorrell, Christopher Lee Tessler
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Patent number: 8123088Abstract: Techniques for dispensing fusible material onto a surface, wherein the fusible material is in molten form, are provided. In accordance with aspects of the invention, a dispensing assembly dispenses the fusible material and a gas environment surrounding a portion of a seal structure of the dispensing assembly is controlled to regulate an oxidation rate of the fusible material.Type: GrantFiled: October 2, 2008Date of Patent: February 28, 2012Assignee: International Business Machines CorporationInventors: Glen Nelson Biggs, Russell A. Budd, Benjamin Vito Fasano, John Joseph Garant, John Peter Karidis, Christopher Lee Tessler, Thomas Weiss
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Patent number: 8123089Abstract: An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas.Type: GrantFiled: October 2, 2008Date of Patent: February 28, 2012Assignee: Internation Business Machines CorporationInventors: Glen Nelson Biggs, Russell A. Budd, Benjamin Vito Fasano, John Joseph Garant, G. Gerard Gormley, John Peter Karidis, Christopher Lee Tessler, Thomas Weiss
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Publication number: 20100084437Abstract: Techniques for dispensing fusible material onto a surface, wherein the fusible material is in molten form, are provided. In accordance with aspects of the invention, a dispensing assembly dispenses the fusible material and a gas environment surrounding a portion of a seal structure of the dispensing assembly is controlled to regulate an oxidation rate of the fusible material.Type: ApplicationFiled: October 2, 2008Publication date: April 8, 2010Inventors: Glen Nelson Biggs, Russell A. Budd, Benjamin Vito Fasano, John Joseph Garant, John Peter Karidis, Christopher Lee Tessler, Thomas Weiss
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Publication number: 20100084438Abstract: An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas.Type: ApplicationFiled: October 2, 2008Publication date: April 8, 2010Inventors: Glen Nelson Biggs, Russell A. Budd, Benjamin Vito Fasano, John Joseph Garant, G. Gerard Gormley, John Peter Karidis, Christopher Lee Tessler, Thomas Weiss
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Patent number: 6973715Abstract: A method of forming a multichip module in which a thin film structure is formed on a temporary carrier and then an electrically insulating frame is attached to the thin film structure. A semiconductor device is attached to the thin film structure and then the temporary carrier is removed. Lastly, at least one semiconductor device is attached to the other side of the thin film structure. There is interconnectvity through the thin film structure between the semiconductor devices and the frame.Type: GrantFiled: December 3, 2003Date of Patent: December 13, 2005Assignee: International Business Machines CorporationInventors: Ajay Prabhakar Giri, Joseph Michael Sullivan, Christopher Lee Tessler
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Patent number: 6892781Abstract: A fixture having a bottom plate, top plate and an expansion block interposed between the bottom plate and top plate. A workpiece is positioned between the expansion block and bottom plate. When the fixture is heated, there is a net displacement exerted by the expansion block so as to apply pressure to the workpiece. The pressure applied by the fixture to the workpiece is due solely to the thermal expansion of the fixture when it is heated.Type: GrantFiled: May 28, 2002Date of Patent: May 17, 2005Assignee: International Business Machines CorporationInventors: Dale C McHerron, Kaushal S. Patel, Christopher Lee Tessler, Jerry A. Gorrell, James Edward Tersigni
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Patent number: 6765152Abstract: A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of packaging, a multilayer thin film structure mounted to the frame, and semiconductor devices mounted to the thin film structure with at least one semiconductor device on each of two opposed sides of the thin film structure. The thin film structure includes arrays of pads on opposed surfaces of the thin film structure for connecting the thin film structure to the semiconductor devices and the frame. The thin film structure further includes wiring for chip to chip connectivity and for connecting to the frame.Type: GrantFiled: September 27, 2002Date of Patent: July 20, 2004Assignee: International Business Machines CorporationInventors: Ajay Prabhakar Giri, Joseph Michael Sullivan, Christopher Lee Tessler
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Publication number: 20040118601Abstract: A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of packaging, a multilayer thin film structure mounted to the frame, and semiconductor devices mounted to the thin film structure with at least one semiconductor device on each of two opposed sides of the thin film structure. The thin film structure includes arrays of pads on opposed surfaces of the thin film structure for connecting the thin film structure to the semiconductor devices and the frame. The thin film structure further includes wiring for chip to chip connectivity and for connecting to the frame.Type: ApplicationFiled: December 3, 2003Publication date: June 24, 2004Inventors: Ajay Prabhakar Giri, Joseph Michael Sullivan, Christopher Lee Tessler
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Publication number: 20040060732Abstract: A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of packaging, a multilayer thin film structure mounted to the frame, and semiconductor devices mounted to the thin film structure with at least one semiconductor device on each of two opposed sides of the thin film structure. The thin film structure includes arrays of pads on opposed surfaces of the thin film structure for connecting the thin film structure to the semiconductor devices and the frame. The thin film structure further includes wiring for chip to chip connectivity and for connecting to the frame.Type: ApplicationFiled: September 27, 2002Publication date: April 1, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Ajay Prabhakar Giri, Joseph Michael Sullivan, Christopher Lee Tessler
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Publication number: 20030221777Abstract: A fixture having a bottom plate, top plate and an expansion block interposed between the bottom plate and top plate. A workpiece is positioned between the expansion block and bottom plate. When the fixture is heated, there is a net displacement exerted by the expansion block so as to apply pressure to the workpiece. The pressure applied by the fixture to the workpiece is due solely to the thermal expansion of the fixture when it is heated.Type: ApplicationFiled: May 28, 2002Publication date: December 4, 2003Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dale C. McHerron, Kaushal S. Patel, Christopher Lee Tessler, Jerry A. Gorrell, James Edward Tersigni
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Patent number: 6413868Abstract: Disclosed is a manufacturable silicon-based modular integrated circuit structure having performance characteristics comparable to high frequency GaAs-based integrated circuit structures, comprising materials and made in process steps which are compatible with existing low cost silicon-based integrated circuit processing.Type: GrantFiled: January 4, 2001Date of Patent: July 2, 2002Assignee: International Business Machines CorporationInventors: Thomas Adam Bartush, David Louis Harame, John Chester Malinowski, Dawn Tudryn Piciacchio, Christopher Lee Tessler, Richard Paul Volant
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Patent number: 6259148Abstract: Disclosed is a manufacturable silicon-based modular integrated circuit structure having performance characteristics comparable to high frequency GaAs-based integrated circuit structures, comprising materials and made in process steps which are compatible with existing low cost silicon-based integrated circuit processing.Type: GrantFiled: June 11, 1999Date of Patent: July 10, 2001Assignee: International Business Machines CorporationInventors: Thomas Adam Bartush, David Louis Harame, John Chester Malinowski, Dawn Tudryn Piciacchio, Christopher Lee Tessler, Richard Paul Volant