Abstract: Light emitting devices with improved light extraction efficiency are provided. The light emitting devices have a stack of layers including semiconductor layers comprising an active region. The stack is bonded to a transparent optical element.

Abstract: The present invention relates to a gateway for connecting a number of incoming analogous and/or digital inputs to a General Packet Radio Service (GPRS) based output. The gateway device comprises: at least one analogous and/or digital data interface for interfacing said inputs, a SIM card, with a specific IP address, an instruction set memory, a wireless transceiver, means for storing collating and managing data, and means for converting input data to GPRS or fixed line data.

Abstract: The present invention relates to a mobile communications network comprising package switched communication ability, the network comprising: one or several mobile stations, a service provider, providing communication with said mobile stations, a user, communicating with said mobile stations, wherein the mobile communications network is arranged to assign said mobile stations with a fixed Internet Protocol (IP) address by means of a server, which is arranged to map a (private) network IP address seamlessly to the public IP address.

Abstract: A method of bonding a transparent optical element to a light emitting device having a stack of layers including semiconductor layers comprising an active region is provided. The method includes elevating a temperature of the optical element and the stack and applying a pressure to press the optical element and the stack together. In one embodiment, the method also includes disposing a layer of a transparent bonding material between the stack and the optical element. The bonding method can be applied to a premade optical element or to a block of optical element material which is later formed or shaped into an optical element such as a lens or an optical concentrator.

Abstract: This technique for assembling a print head for an LED printer has LED dice first assembled into precisely known locations on mounting tiles. A portion of the front face of each tile is left exposed beyond anything mounted on the tile. The tiles are then assembled with these exposed areas on a planar reference on an assembly fixture. Reference surfaces built into the fixture align the edges of the tiles, and hence the LED dice. Finally a mother plate is adhesively bonded onto the backs of the tiles. The adhesive accommodates thickness variations in the mounting tiles, and lack of flatness in the back surfaces of the tiles and the front face of the mother plate. Reference tiles coplanar with the reference plane formed by the front faces of the mounting tiles provide a z axis reference.

Abstract: This technique for assembling a print head for an LED printer has LED dice first assembled into precisely known locations on mounting tiles. A portion of the front face of each tile is left exposed beyond anything mounted on the tile. The tiles are then assembled with these exposed areas on a planar reference on an assembly fixture. Reference surfaces built into the fixture align the edges of the tiles, and hence the LED dice. Finally a mother plate is adhesively bonded onto the backs of the tiles. The adhesive accommodates thickness variations in the mounting tiles, and lack of flatness in the back surfaces of the tiles and the front face of the mother plate. Reference tiles copolanar with the reference plane formed by the front faces of the mounting tiles provide a z axis reference.