Patents by Inventor Christopher Lucero

Christopher Lucero has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060215363
    Abstract: In general, in one aspect, the disclosure describes an apparatus to redistribute airflow throw slots of a chassis that houses boards. The apparatus includes at least one restriction region to limit airflow therethrough. The apparatus further includes an open region to allow airflow to pass therethrough. At least some of the airflow limited by the at least one restriction region will flow through the open region. The apparatus also includes a connection mechanism to connect to a chassis.
    Type: Application
    Filed: March 23, 2005
    Publication date: September 28, 2006
    Inventors: James Shipley, Javier Leija, Christopher Gonzales, Christopher Lucero
  • Publication number: 20060199498
    Abstract: A method according to one embodiment may include providing a chassis comprising at least one selectively deployable fan disposed within the chassis. The method of this embodiment may also include moving the fan from a stowed configuration to a deployed configuration within the chassis and energizing the at least one fan. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
    Type: Application
    Filed: February 8, 2005
    Publication date: September 7, 2006
    Inventors: James Shipley, Javier Leija, Christopher Gonzales, Christopher Lucero
  • Publication number: 20060139897
    Abstract: A method according to one embodiment may include providing a circuit board assembly comprising a circuit board and a rotatable knob and at least one latch coupled to the knob via a linkage. The method of this embodiment may also include moving the at least one latch to a retracted position by rotating the knob, and inserting the circuit board assembly into a chassis. The method may then include moving the latch to an extended position. Of course, many alternatives, variations, and modification are possible without departing from this embodiment.
    Type: Application
    Filed: December 29, 2004
    Publication date: June 29, 2006
    Inventors: James Shipley, Javier Leija, Christopher Gonzales, Christopher Lucero
  • Publication number: 20060120038
    Abstract: A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
    Type: Application
    Filed: December 6, 2004
    Publication date: June 8, 2006
    Inventors: Christopher Lucero, Javier Leija, James Shipley, Christopher Gonzales
  • Publication number: 20060002080
    Abstract: The specification discloses an apparatus comprising a cold plate having an inlet and an outlet, the cold plate being attachable to a heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger. The specification also discloses a process comprising cooling a heat source using a closed-loop cooling system comprising a cold plate having an inlet and an outlet, the cold plate being attachable to the heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger, and removing or installing the pump module while the cooling system is operating.
    Type: Application
    Filed: June 30, 2004
    Publication date: January 5, 2006
    Inventors: Javier Leija, Christopher Lucero, Christopher Gonzales
  • Publication number: 20050286222
    Abstract: A reconfigurable airflow director for modular blade chassis. The airflow director includes multiple duct channels having adjustable inlets and/or outlets. The airflow director may be reconfigured to adjust the amount of airflow across selected blades and selected zones on an individual blade. In one embodiment, snap-in airflow blockers are employed to block all or a portion of selected inlets or outlets to adjust the airflow through corresponding duct channels. In one embodiment, adjustable inlet vanes are employed to increase or decrease the size of adjacent inlets. In one embodiment, the airflow director is formed from multiple airflow director modules, each including an outer shell having multiple ribs extending therefrom to form multiple airflow channels, wherein the airflow director modules are stacked together to form a plurality of duct channels. Modular fan assemblies including multiple hot-swappable fans are employed to push and/or draw airflow through the duct channels of the airflow director.
    Type: Application
    Filed: June 24, 2004
    Publication date: December 29, 2005
    Inventors: Christopher Lucero, Javier Leija
  • Publication number: 20050279104
    Abstract: A thermoelectric module having areas of highly thermally conductive material integrated into a substrate layer. For one embodiment copper pads are integrated into the external surface of the substrate of the hot side of the thermoelectric module. The copper pads allow direct connection of a heat removal device to the thermoelectric module thereby reducing thermal resistance. Thermal vias may be formed through the substrate to further reduce thermal resistance.
    Type: Application
    Filed: June 22, 2004
    Publication date: December 22, 2005
    Inventors: Javier Leija, Christopher Lucero
  • Publication number: 20050091989
    Abstract: A cooling system for an electronic component is provided. The cooling system includes a plurality of thermoelectric elements for placement above a plurality of different areas of the electronic component. The cooling system has a plurality of conductors connected to the thermoelectric elements for providing current to the thermoelectric elements, such that the thermoelectric elements pump heat away from the respective areas. The cooling system has a control apparatus connected to the conductors for controlling current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.
    Type: Application
    Filed: November 4, 2003
    Publication date: May 5, 2005
    Inventors: Javier Leija, Christopher Lucero