Patents by Inventor Christopher M. Buck

Christopher M. Buck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11288909
    Abstract: A secure ballot collection system is formed of a removable container that may be positioned within a voting machine and used for collecting paper ballots as they are cast. The container itself is capable of being sealed after removal from the voting machine to ensure the security of the paper ballots. The removable container is placed on a raised floor platform that is also positioned within the interior of the voting machine. The platform provides easy access to the interior of the voting machine from a side opening and allows for the ballot container bag to be located at a height where it is relatively straightforward for an election official to place an “empty” container bag at the beginning of the voting process, and also remove a “filled” container bag at some point in time thereafter.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: March 29, 2022
    Assignee: A. Rifkin Co.
    Inventors: Paul D. Lantz, Donald R. Casterline, Christopher M. Buck
  • Publication number: 20210005042
    Abstract: A secure ballot collection system is formed of a removable container that may be positioned within a voting machine and used for collecting paper ballots as they are cast. The container itself is capable of being sealed after removal from the voting machine to ensure the security of the paper ballots. The removable container is placed on a raised floor platform that is also positioned within the interior of the voting machine. The platform provides easy access to the interior of the voting machine from a side opening and allows for the ballot container bag to be located at a height where it is relatively straightforward for an election official to place an “empty” container bag at the beginning of the voting process, and also remove a “filled” container bag at some point in time thereafter.
    Type: Application
    Filed: June 17, 2020
    Publication date: January 7, 2021
    Applicant: A. Rifkin Co.
    Inventors: Paul D. Lantz, Donald R. Casterline, Christopher M. Buck
  • Patent number: 7064632
    Abstract: A microwave circuit comprises a printed circuit board (PCB) on which is fabricated a circuit including passive components such as filters (40) formed by printed conductive patterns. In order to enhance the performance of the circuit, selected components such as filters are made with a greater precision on substrate material (41), such as alumina, having a higher dielectric constant than that of the printed circuit board material. The finished component is mounted on the printed circuit board and the conductive pattern is connected by wire bonds (48, 50) to microstrip tracks (51) of the printed circuit board.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: June 20, 2006
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Christopher M. Buck, Keith R. Williams
  • Patent number: 6833775
    Abstract: A microwave circuit comprises a printed circuit board (PCB) on which is fabricated a circuit including passive components such as filters (40) formed by printed conductive patterns. In order to enhance the performance of the circuit, selected components such as filters are made with a greater precision on substrate material (41), such as alumina, having a higher dielectric constant than that of the printed circuit board material. The finished component is mounted on the printed circuit board and the conductive pattern is connected by wire bonds (48, 50) to microstrip tracks (51) of the printed circuit board.
    Type: Grant
    Filed: April 2, 2002
    Date of Patent: December 21, 2004
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Christopher M. Buck, Keith R. Williams
  • Patent number: 6639486
    Abstract: A transition from microstrip to waveguide comprises a rectangular waveguide and a microstrip structure formed by a resilient substrate (24) having a stripline (26) on one surface and a ground plane (44) on an opposite surface, the conductors (26, 44) being interconnected by viaholes. The substrate (24) is disposed between the side walls (36) and the floor (22) of the waveguide with the ground plane contacting the floor. The stripline extends from one end of the waveguide along a portion of its length. A tapered ridge (38) depends from the ceiling (34) of the waveguide and extends from the other end of the waveguide. A terminal end (40) of the ridge contacts a terminal portion of the stripline under mechanical pressure. The ridge (38) may have a choice of profiles such as triangular, half cosine and half cosine with a semicircular cut-out in the upright edge.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: October 28, 2003
    Assignee: Koninklijke Philips Electronics N.V.
    Inventor: Christopher M. Buck
  • Publication number: 20020180567
    Abstract: A microwave circuit comprises a printed circuit board (PCB) on which is fabricated a circuit including passive components such as filters (40) formed by printed conductive patterns. In order to enhance the performance of the circuit, selected components such as filters are made with a greater precision on substrate material (41), such as alumina, having a higher dielectric constant than that of the printed circuit board material. The finished component is mounted on the printed circuit board and the conductive pattern is connected by wire bonds (48, 50) to microstrip tracks (51) of the printed circuit board.
    Type: Application
    Filed: April 2, 2002
    Publication date: December 5, 2002
    Applicant: Koninklijke Philips Electronics N.V.
    Inventors: Christopher M. Buck, Keith R. Williams
  • Publication number: 20020163397
    Abstract: A transition from microstrip to waveguide comprises a rectangular waveguide and a microstrip structure formed by a resilient substrate (24) having a stripline (26) on one surface and a ground plane (44) on an opposite surface, the conductors (26, 44) being interconnected by viaholes. The substrate (24) is disposed between the side walls (36) and the floor (22) of the waveguide with the ground plane contacting the floor. The stripline extends from one end of the waveguide along a portion of its length. A tapered ridge (38) depends from the ceiling (34) of the waveguide and extends from the other end of the waveguide. A terminal end (40) of the ridge contacts a terminal portion of the stripline under mechanical pressure. The ridge (38) may have a choice of profiles such as triangular, half cosine and half cosine with a semicircular cut-out in the upright edge.
    Type: Application
    Filed: March 22, 2002
    Publication date: November 7, 2002
    Applicant: Koninklijke Philips Electronics N.V.
    Inventor: Christopher M. Buck