Abstract: An apparatus for guidance and retention of integrated circuit boards includes a first structure configured to receive a first integrated circuit board and guide the first integrated circuit board for coupling to a substrate. The apparatus further includes a second structure configured to be removably coupled to the first structure. The second structure includes a first spring member configured to apply a first compressive force to the first integrated circuit board.

Abstract: A latch assembly includes a lever arm affixed to a latch pivot point of rotation with a cam having a connecting slot. A load mechanism is configured to apply a force on the latch pivot point to retain the lever arm in a first position. The load mechanism is tuned to apply the force along a tolerance range of operation of the latch assembly.

Abstract: A system, an article of manufacture, and a method are disclosed. The system includes a set of components in an enclosure. The set of components includes electronic devices and airflow moving components configured to maintain airflow across the electronic devices from a front plenum of the enclosure to a rear plenum of the enclosure and direct air from the rear plenum through the first heat exchanger. The set of components also includes a first heat exchanger configured to circulate a cooling liquid and a second heat exchanger configured to maintain a constant temperature of the cooling liquid, wherein the constant temperature is a temperature of the cooling liquid within a threshold distance from a selected temperature.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Abstract: A system, an article of manufacture, and a method are disclosed. The system includes a set of components in an enclosure. The set of components includes electronic devices and airflow moving components configured to maintain airflow across the electronic devices from a front plenum of the enclosure to a rear plenum of the enclosure and direct air from the rear plenum through the first heat exchanger. The set of components also includes a first heat exchanger configured to circulate a cooling liquid and a second heat exchanger configured to maintain a constant temperature of the cooling liquid, wherein the constant temperature is a temperature of the cooling liquid within a threshold distance from a selected temperature.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Abstract: A method and apparatuses are provided for removing a cold plate assembly from an electronics enclosure. The apparatus includes a chassis configured to be placed on the electronics housing in an aligned manner. The chassis includes a plurality of brackets disposed on the chassis. The respective ones of the plurality of brackets are configured to be attached to respective electrical components in the electronics housing. The respective ones of the plurality of brackets are also configured to be disposed on the chassis at locations corresponding to the locations of the respective electrical components within the electronics housing when the chassis is aligned with the electronics housing. The respective ones of the plurality of brackets are also configured to selectively movable between a first orientation and a second orientation. The respective brackets are closer to the respective electrical components in the first orientation than in the second orientation.

Abstract: A method and apparatus includes a first fin structure having a flat portion for a cooling medium to travel across. The first fin structure additionally includes a coupling portion on a first edge of the flat portion. The coupling portion may include an aperture and an arm. The coupling portion may be long enough to attach to a corresponding aperture in a corresponding coupling portion of a corresponding second sink fin structure. The corresponding second sink fin structure may be more than one fin structure away from the first heat sink fin.

Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Abstract: A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.

Abstract: A method and apparatuses are provided for removing a cold plate assembly from an electronics enclosure. The apparatus includes a chassis configured to be placed on the electronics housing in an aligned manner. The chassis includes a plurality of brackets disposed on the chassis. The respective ones of the plurality of brackets are configured to be attached to respective electrical components in the electronics housing. The respective ones of the plurality of brackets are also configured to be disposed on the chassis at locations corresponding to the locations of the respective electrical components within the electronics housing when the chassis is aligned with the electronics housing. The respective ones of the plurality of brackets are also configured to selectively movable between a first orientation and a second orientation. The respective brackets are closer to the respective electrical components in the first orientation than in the second orientation.

Abstract: A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.

Abstract: A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.

Abstract: A shelf device facilitates access to electronic modules within an enclosure having multiple vertically stacked levels of module storage locations. A pair of support arms each have an attachment structure on a distal portion of the support arm that is designed to attach to a first one of the vertically stacked levels. A guide rail extends from the distal portion of the support arm toward a proximal portion of the support arm. A cross brace structure is configured to pivotally attach to distal portions of the pair of support arms and a proximal portion of a first one of the support arms. A pair of vertical braces are each configured to pivotally attach to a respective one of the pair of support arms and having a detachable connection structure that is designed to attach to a second one of the vertically stacked levels.

Abstract: A shelf device facilitates access to electronic modules within an enclosure having multiple vertically stacked levels of module storage locations. A pair of support arms each have an attachment structure on a distal portion of the support arm that is designed to attach to a first one of the vertically stacked levels. A guide rail extends from the distal portion of the support arm toward a proximal portion of the support arm. A cross brace structure is configured to pivotally attach to distal portions of the pair of support arms and a proximal portion of a first one of the support arms. A pair of vertical braces are each configured to pivotally attach to a respective one of the pair of support arms and having a detachable connection structure that is designed to attach to a second one of the vertically stacked levels.