Patents by Inventor Christopher Marc Scanlan

Christopher Marc Scanlan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package including a top-surface metal layer for implementing circuit features
    Patent number: 8227338
    Abstract: A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The metal layer interconnected with an internal substrate of the semiconductor package by blind vias laser-ablated through the encapsulation and filled with metal. The vias extend from the top surface to an internal package substrate or through the encapsulation to form bottom-side terminals. The metal layer may be formed by circuit patterns and/or terminals embedded within the encapsulation conformal to the top surface by laser-ablating channels in the top surface of the encapsulation and filling the channels with metal. A conformal coating may be applied to the top surface of the semiconductor package over the metal layer to prevent solder bridging to circuit patterns of the metal layer.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: July 24, 2012
    Assignee: Amkor Technology, Inc.
    Inventors: Christopher Marc Scanlan, Ronald Patrick Huemoeller
  • Semiconductor package including a top-surface metal layer for implementing circuit features
    Patent number: 8018068
    Abstract: A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The metal layer interconnected with an internal substrate of the semiconductor package by blind vias laser-ablated through the encapsulation and filled with metal. The vias extend from the top surface to an internal package substrate or through the encapsulation to form bottom-side terminals. The metal layer may be formed by circuit patterns and/or terminals embedded within the encapsulation conformal to the top surface by laser-ablating channels in the top surface of the encapsulation and filling the channels with metal. A conformal coating may be applied to the top surface of the semiconductor package over the metal layer to prevent solder bridging to circuit patterns of the metal layer.
    Type: Grant
    Filed: October 28, 2009
    Date of Patent: September 13, 2011
    Assignee: Amkor Technology, Inc.
    Inventors: Christopher Marc Scanlan, Ronald Patrick Huemoeller
  • Semiconductor package including a top-surface metal layer for implementing circuit features
    Patent number: 7633765
    Abstract: A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The metal layer interconnected with an internal substrate of the semiconductor package by blind vias laser-ablated through the encapsulation and filled with metal. The vias extend from the top surface to an internal package substrate or through the encapsulation to form bottom-side terminals. The metal layer may be formed by circuit patterns and/or terminals embedded within the encapsulation conformal to the top surface by laser-ablating channels in the top surface of the encapsulation and filling the channels with metal. A conformal coating may be applied to the top surface of the semiconductor package over the metal layer to prevent solder bridging to circuit patterns of the metal layer.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: December 15, 2009
    Assignee: Amkor Technology, Inc.
    Inventors: Christopher Marc Scanlan, Ronald Patrick Huemoeller
  • Multi-chip semiconductor package with integral shield and antenna
    Patent number: 7049682
    Abstract: A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: May 23, 2006
    Assignees: Amkor Technology, Inc., Tyco Electronics Logistics AG
    Inventors: Douglas Jay Mathews, Robert Joseph Hill, Michael Paul Gaynor, Ronald James Schoonejongen, John Armando Miranda, Christopher Marc Scanlan
  • Multi-chip semiconductor package with integral shield and antenna
    Patent number: 6686649
    Abstract: A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.
    Type: Grant
    Filed: May 14, 2001
    Date of Patent: February 3, 2004
    Assignees: Amkor Technology, Inc., Tyco Electronics Logistics AG
    Inventors: Douglas Jay Mathews, Robert Joseph Hill, Michael Paul Gaynor, Ronald James Schoonejongen, John Armando Miranda, Christopher Marc Scanlan