Abstract: A vacuum exhaust system includes a plurality of turbo pumps that evacuate a plurality of vacuum chambers. A plurality of chamber valves are positioned between the turbo pumps and the plurality of vacuum chambers. A plurality of branch channels are each connected to a corresponding exhaust of the plurality of turbo pumps and a main channel is formed from a confluence of the branch channels. A booster vacuum pump is connected to the main channel. A backing vacuum pump is connected to an exhaust of the booster vacuum pump. A plurality of bypass channels, each having a valve, provide a fluid communication path between at least some of the plurality of vacuum chambers and the booster vacuum pump.

Abstract: A vacuum pumping system which comprises a plurality of vacuum pumping arrangements for evacuating a flammable gas stream and exhausting the gas stream through an exhaust outlet. A housing houses the vacuum pumping arrangements and forms an air flow duct for an air flow for mixing with the exhaust gas stream output from the exhaust outlet in a mixing region in the housing. An airflow generator generates an air flow through the air flow duct to cause mixing of air with the flammable gas stream to a percentage of the flammable gas in the air flow lower than the lower flammability limit of the flammable gas. An airflow sensor senses the flow of air for determining if the air flow is sufficient to dilute the flammable gas to lower than said percentage.

Abstract: A kit of parts for forming a foreline for coupling a process chamber to a vacuum pumping and/or abatement system, the kit comprising: a plurality of foreline segments; wherein each foreline segment is a pipe that comprises: a first substantially straight end portion; a second substantially straight end portion opposite to the first end portion; and an intermediate portion disposed between the first and second end portions and connected to the first and second end portions by respective bends; the first and second end portions are substantially parallel to each other; the intermediate portion is oblique to the first and second end portions; and the foreline segments are configured to be attached together so as to form a continuous foreline.

Abstract: A vacuum pumping and/or abatement system for evacuating and/or abating fluid from an entity, the system comprising: a first module comprising a vacuum pumping apparatus for pumping the fluid from the entity and/or an abatement apparatus for abating the fluid evacuated from the entity; and a second module arranged adjacent to the first module in a first system dimension; wherein the first and second modules each have a maximum size in the first system dimension that is a respective integer multiple of a common fixed system value.

Abstract: A vacuum pump and vacuum assembly. The vacuum pump comprises: an inlet for receiving gas; and an exhaust for exhausting the gas; a hollow shaft defining an axial passage extending through the pump from an opening in a base of the pump to an opening axially beyond the pump inlet. The shaft comprises an end remote from the base of the pump, the end being configured to attach to a cathode plate within a vacuum chamber evacuated by the vacuum pump. The shaft is configured for axial movement of the end between at least one open position in which the end is remote from the inlet of the vacuum pump and a sealing position in which the end is closer to the inlet.

Abstract: A vacuum pump, vacuum pump arrangement and method are disclosed. The vacuum pump includes at least one rotor; and a stator, an inlet for receiving gas during operation; and an exhaust for exhausting the gas. The vacuum pump includes a shaft extending through a centre of said pump and comprising a plate mounted on an end of the shaft towards the inlet. The vacuum pump includes control circuitry configured to control an axial position of the plate, a change in axial position of the plate providing a change in inlet conductance of gas to the vacuum pump. The plate is mounted such that it extends beyond the inlet in at least some axial positions of the rotor such that the plate is not on the same side of the inlet as the stator.

Abstract: A vacuum pump, vacuum pump arrangement and method are disclosed. The vacuum pump includes at least one rotor; and a stator, an inlet for receiving gas during operation; and an exhaust for exhausting the gas. The vacuum pump includes a shaft extending through a centre of said pump and comprising a plate mounted on an end of the shaft towards the inlet. The vacuum pump includes control circuitry configured to control an axial position of the plate, a change in axial position of the plate providing a change in inlet conductance of gas to the vacuum pump. The plate is mounted such that it extends beyond the inlet in at least some axial positions of the rotor such that the plate is not on the same side of the inlet as the stator.

Abstract: A system comprising a pumping system configured to pump respective exhaust gases from each of a plurality of chemical etching process chambers and to combine the exhaust gases to provide a combined exhaust gas, and a noble gas recovery system configured to process the combined exhaust gas to remove one or more noble gases therefrom.

Abstract: A vacuum exhaust system includes a plurality of low pressure vacuum pumps that operate in a molecular flow region and evacuate a plurality of vacuum chambers. A plurality of chamber valves are positioned between the low pressure vacuum pumps and the plurality of vacuum chambers. A plurality of branch channels are each connected to a corresponding exhaust of the plurality of low pressure vacuum pumps and a main channel is formed from a confluence of the branch channels. An intermediate vacuum pump is connected to the main channel and operates in a viscous flow region. A higher pressure vacuum pump operates in a higher pressure viscous flow region and is connected to an exhaust of the intermediate pressure vacuum pump. A plurality of bypass channels, each having a valve, provide a fluid communication path between at least some of the plurality of vacuum chambers and a higher pressure vacuum pump.

Abstract: A vacuum pumping arrangement comprises a first pump which has a first inlet and a first outlet. The first inlet is fluidly connected to a first common pumping line. The first common pumping line includes a plurality of first pumping line inlets each of which is fluidly connectable to a least one process chamber within a group of process chambers that form a semiconductor fabrication tool. The vacuum pumping arrangement also includes a reserve pump which has a reserve inlet and a reserve outlet. The reserve inlet is selectively fluidly connectable to each process chamber within the group of process chambers that form the semiconductor fabrication tool. The vacuum pumping arrangement additionally includes a controller which is configured to selectively fluidly isolate the pump from one or more given process chambers and selectively fluidly connect the reserve pump with the said one or more given process chambers.

Abstract: A vacuum pumping arrangement comprising multiple pumping stages for evacuating a process chamber and a method of cleaning the vacuum pumping arrangement is discussed. The vacuum pumping arrangement comprises: at least one turbomolecular pumping stage; at least one further pumping stage downstream of the turbomolecular pumping stage; and at least one inlet for admitting radicals into the vacuum pumping arrangement, the at least one inlet being located downstream of the turbomolecular stage and upstream of at least one of the at least one further pumping stage.

Abstract: A turbomolecular pump and method and apparatus for controlling the pressure in a process chamber using such a pump is disclosed. The turbomolecular comprises: a rotor comprising a plurality of blades on a rotatable shaft; a control motor for driving the rotatable shaft; wherein the control motor is sized to output a power that is more than three times larger than a power required to drive the shaft at a constant velocity that is sufficiently high to provide an exhaust pressure of 5 millibars.

Abstract: A vacuum pumping and/or abatement system for evacuating and/or abating fluid from an entity, the system comprising: a first module comprising a vacuum pumping apparatus for pumping the fluid from the entity and/or an abatement apparatus for abating the fluid evacuated from the entity; and a second module arranged adjacent to the first module in a first system dimension; wherein the first and second modules each have a maximum size in the first system dimension that is a respective integer multiple of a common fixed system value.

Abstract: An apparatus and method for supplying gas to improve heat transfer between a wafer and chuck is disclosed. The apparatus comprises at least one processing chamber comprising a chuck for mounting a semiconductor wafer; at least one processing chamber vacuum pump for evacuating the at least one processing chamber; and a gas supply apparatus for supplying gas to the chuck for providing cooling to a backside of the semiconductor wafer, the gas supply apparatus comprising: a conduit for connecting to a gas supply; a gas supply apparatus vacuum pump, an inlet of the gas supply apparatus vacuum pump being connected to the conduit; the conduit comprising a junction connecting to a further conduit the further conduit being in fluid communication with the chuck.

Abstract: Dry pumps are used to pump a variety of gas mixtures from the semiconductor industry. The present invention provides a liquid ring pump located between the dry pump and an abatement device to remove soluble corrosive materials prior to the exhaust gases entry to the abatement device, the work fluid exhausted from the liquid ring pump being separated from the gas prior to entry to the abatement device.

Abstract: A vacuum pumping arrangement comprises a first pump which has a first inlet and a first outlet. The first inlet is fluidly connected to a first common pumping line. The first common pumping line includes a plurality of first pumping line inlets each of which is fluidly connectable to a least one process chamber within a group of process chambers that form a semiconductor fabrication tool. The vacuum pumping arrangement also includes a reserve pump which has a reserve inlet and a reserve outlet. The reserve inlet is selectively fluidly connectable to each process chamber within the group of process chambers that form the semiconductor fabrication tool. The vacuum pumping arrangement additionally includes a controller which is configured to selectively fluidly isolate the pump from one or more given process chambers and selectively fluidly connect the reserve pump with the said one or more given process chambers.

Abstract: A vacuum pumping system which comprises a plurality of vacuum pumping arrangements for evacuating a flammable gas stream and exhausting the gas stream through an exhaust outlet. A housing houses the vacuum pumping arrangements and forms an air flow duct for an air flow for mixing with the exhaust gas stream output from the exhaust outlet in a mixing region in the housing. An airflow generator generates an air flow through the air flow duct to cause mixing of air with the flammable gas stream to a percentage of the flammable gas in the air flow lower than the lower flammability limit of the flammable gas. An airflow sensor senses the flow of air for determining if the air flow is sufficient to dilute the flammable gas to lower than said percentage.

Abstract: A vacuum pump, vacuum pump arrangement and method are disclosed. The vacuum pump comprises: at least one rotor; and a stator, an inlet for receiving gas during operation; and an exhaust for exhausting the gas. The vacuum pump comprises a shaft extending through a centre of said pump and comprising a plate mounted on an end of the shaft towards the inlet. The vacuum pump comprises control circuitry configured to control an axial position of the plate, a change in axial position of the plate providing a change in inlet conductance of gas to the vacuum pump. The plate is mounted such that it extends beyond the inlet in at least some axial positions of the rotor such that the plate is not on the same side of the inlet as the stator.

Abstract: Dry pumps are used to pump a variety of gas mixtures from the semiconductor industry. The present invention provides a liquid ring pump located between the dry pump and an abatement device to remove soluble corrosive materials prior to the exhaust gases entry to the abatement device, the work fluid exhausted from the liquid ring pump being separated from the gas prior to entry to the abatement device.

Abstract: An apparatus includes a foreline for conveying a waste stream which is drawn from a process chamber to a pumping mechanism. The foreline comprises an isolation valve for selectively isolating the pumping mechanism from the process chamber and a bypass positioned around the isolation valve. The apparatus further comprises a controller for actuating the isolation valve. The controller is configured to cause the isolation valve to be closed when the waste stream is initially drawn from the process chamber, during which time the waste stream is conveyed to the pumping mechanism via the bypass. The bypass includes means for inhibiting propagation of a flame front therethrough. The controller is configured to cause the isolation valve to be opened once a pressure within a region upstream of the isolation valve has been reduced below a value at which propagation of a flame front within the waste stream can be sustained.