Abstract: An electronic device is provided. The electronic device includes a circuit board having heat generating components thereon. The electronic device further includes a heat sink with air current generating electric device assembly, disposed over the circuit board, through which heat from the circuit board and the components thereon is released. The heat sink with air current generating electric device assembly includes a heat sink having a solid central core and a plurality of fins protruding from the core. The heat sink with air current generating electric device assembly further includes an air current generating electric device disposed over the heat sink and having an air intake facing a top of the heat sink and an exhaust opening directed parallel to a plane of the circuit board.

Abstract: There is provided an electronic device. The electronic device includes a circuit board having heat generating components thereon. The electronic device further includes spring clips or bend tabs. The electronic device also includes a heat sink, disposed over the circuit board, through which heat from the circuit board and the components thereon is released. The heat sink has a generally flat horizontal base and a series of vertically directed fins. The heat sink is secured to at least one of the circuit board and at least one of the components thereon by the spring clips or bend tabs being positioned at a periphery of the horizontal base. The spring clips or bend tabs have distal contact prongs that contact and apply downward force on the horizontal base.

Abstract: An electronic device is described including a sliding vertical door, the sliding vertical door having a top, a bottom, and two vertical sides, wherein each of the two vertical sides has a locking latch at a bottom edge of each of the two vertical sides, the locking latch being between two vertical encouraging slots in each of the two vertical sides of the sliding vertical door, and wherein the siding vertical door has a front face, the front face of the sliding vertical door having a door handle positioned at, near or adjacent to the bottom of the sliding vertical door, the door handle being centered horizontally on the sliding vertical door and a sliding door bay, the sliding door bay having a bottom edge, the sliding door bay having side walls, the side walls having grooves therein.

Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

Abstract: An energy management system that facilitates the transfer of high frequency energy induced on an implanted lead or a leadwire includes an energy dissipating surface associated with the implanted lead or the leadwire, a diversion or diverter circuit associated with the energy dissipating surface, and at least one switch disposed between the diversion circuit and the AIMD electronics for diverting energy in the implanted lead or the leadwire through the diversion circuit to the energy dissipating surface. The switch may comprise a single or multi-pole double or single throw switch. The diversion circuit may be either a high pass filter or a low pass filter.

Abstract: An energy management system facilitates the transfer of high frequency energy coupled into an implanted lead at a selected RF frequency or frequency band, to an energy dissipating surface. This is accomplished by conductively coupling the implanted lead to the energy dissipating surface through an energy diversion circuit including one or more passive electronic network components whose impedance characteristics are at least partially tuned to the implanted lead's impedance characteristics.

Abstract: A light pipe bracket (6) for an electronic device is provided that comprises a planar main body, light pipes (13) each having a proximal end and a distal end in which the light pipe extends from the distal end at the planar main body toward the distal end, and circuit board holding means (7) that support at least a portion of a circuit in the electronic device.

Abstract: An energy management system that facilitates the transfer of high frequency energy induced on an implanted lead or a leadwire includes an energy dissipating surface associated with the implanted lead or the leadwire and at least one non-linear circuit element switch for diverting energy in the implanted lead or the leadwire to the energy dissipating surface. In alternate configurations, the switch may be disposed so that it electrically opens the implanted lead or the leadwire when diverting energy to the energy dissipating surface. The non-linear circuit element switch is typically a PIN diode.

Abstract: An energy management system that facilitates the transfer of high frequency energy induced on an implanted lead or a leadwire includes an energy dissipating surface associated with the implanted lead or the leadwire, a diversion or diverter circuit associated with the energy dissipating surface, and at least one non-linear circuit element switch for diverting energy in the implanted lead or the leadwire through the diversion circuit to the energy dissipating surface. In alternate configurations, the switch may be disposed between the implanted lead or the leadwire and the diversion circuit, or disposed so that it electrically opens the implanted lead or the leadwire when diverting energy through the diversion circuit to the energy dissipating surface. The non-linear circuit element switch is typically a PIN diode. The diversion circuit may be either a high pass filter or a low pass filter.

Abstract: An energy management system that facilitates the transfer of high frequency energy induced on an implanted lead or a leadwire includes an energy dissipating surface associated with the implanted lead or the leadwire, a diversion or diverter circuit associated with the energy dissipating surface, and at least one non-linear circuit element switch for diverting energy in the implanted lead or the leadwire through the diversion circuit to the energy dissipating surface. In alternate configurations, the switch may be disposed between the implanted lead or the leadwire and the diversion circuit, or disposed so that it electrically opens the implanted lead or the leadwire when diverting energy through the diversion circuit to the energy dissipating surface. The non-linear circuit element switch is typically a PIN diode. The diversion circuit may be either a high pass filter or a low pass filter.

Abstract: An energy management system that facilitates the transfer of high frequency energy induced on an implanted lead or a leadwire includes an energy dissipating surface associated with the implanted lead or the leadwire, a diversion or diverter circuit associated with the energy dissipating surface, and at least one switch disposed between the diversion circuit and the AIMD electronics for diverting energy in the implanted lead or the leadwire through the diversion circuit to the energy dissipating surface. The switch may comprise a single or multi-pole double or single throw switch. The diversion circuit may be either a high pass filter or a low pass filter.

Abstract: An energy management system that facilitates the transfer of high frequency energy induced on an implanted lead or a leadwire includes an energy dissipating surface associated with the implanted lead or the leadwire, a diversion or diverter circuit associated with the energy dissipating surface, and at least one non-linear circuit element switch for diverting energy in the implanted lead or the leadwire through the diversion circuit to the energy dissipating surface. In alternate configurations, the switch may be disposed between the implanted lead or the leadwire and the diversion circuit, or disposed so that it electrically opens the implanted lead or the leadwire when diverting energy through the diversion circuit to the energy dissipating surface. The non-linear circuit element switch is typically a PIN diode. The diversion circuit may be either a high pass filter or a low pass filter.

Abstract: An energy management system that facilitates the transfer of high frequency energy induced on an implanted lead or a leadwire includes an energy dissipating surface associated with the implanted lead or the leadwire, a diversion or diverter circuit associated with the energy dissipating surface, and at least one switch for diverting energy in the implanted lead or the leadwire through the diversion circuit to the energy dissipating surface. In alternate configurations, the switch may be disposed between the implanted lead or the leadwire and the diversion circuit, or disposed so that it electrically opens the implanted lead or the leadwire when diverting energy through the diversion circuit to the energy dissipating surface. The switch may comprise a single or multi-pole double or single throw switch. The diversion circuit may be either a high pass filter or a low pass filter.

Abstract: An energy management system that facilitates the transfer of high frequency energy induced on an implanted lead or a leadwire includes an energy dissipating surface associated with the implanted lead or the leadwire, a diversion or diverter circuit associated with the energy dissipating surface, and at least one non-linear circuit element switch for diverting energy in the implanted lead or the leadwire through the diversion circuit to the energy dissipating surface. In alternate configurations, the switch may be disposed between the implanted lead or the leadwire and the diversion circuit, or disposed so that it electrically opens the implanted lead or the leadwire when diverting energy through the diversion circuit to the energy dissipating surface. The non-linear circuit element switch is typically a PIN diode. The diversion circuit may be either a high pass filter or a low pass filter.

Abstract: An energy management system that facilitates the transfer of high frequency energy induced on an implanted lead or a leadwire includes an energy dissipating surface associated with the implanted lead or the leadwire, a diversion or diverter circuit associated with the energy dissipating surface, and at least one switch disposed between the diversion circuit and the AIMD electronics for diverting energy in the implanted lead or the leadwire through the diversion circuit to the energy dissipating surface. The switch may comprise a single or multi-pole double or single throw switch. The diversion circuit may be either a high pass filter or a low pass filter.

Abstract: An energy management system facilitates the transfer of high frequency energy coupled into an implanted abandoned lead at a selected RF frequency or frequency band, to an energy dissipating surface. This is accomplished by conductively coupling the implanted abandoned lead to the energy dissipating surface of an abandoned lead cap through an energy diversion circuit including one or more passive electronic network components whose impedance characteristics are at least partially tuned to the implanted abandoned lead's impedance characteristics.

Abstract: One or more inductors and one or more capacitors are physically disposed relative to one another in series and are electrically connected to one another in parallel to form a bandstop filter. Chip inductors and chip capacitors having spaced apart conductive terminals are physically arranged in end-to-end abutting relation to minimize electrical potential between adjacent conductive terminals. The bandstop filter may be hermetically sealed within a biocompatible container for use with an implantable lead or electrode of a medical device. The values of the inductors and the capacitors are selected such that the bandstop filter is resonant at one or more selected frequencies, such as an MRI pulsed frequency.

Abstract: One or more inductors and one or more capacitors are physically disposed relative to one another in series and are electrically connected to one another in parallel to form a bandstop filter. Chip inductors and chip capacitors having spaced apart conductive terminals are physically arranged in end-to-end abutting relation to minimize electrical potential between adjacent conductive terminals. The bandstop filter may be hermetically sealed within a biocompatible container for use with an implantable lead or electrode of a medical device. The values of the inductors and the capacitors are selected such that the bandstop filter is resonant at one or more selected frequencies, such as an MRI pulsed frequency.

Abstract: One or more inductors and one or more capacitors are physically disposed relative to one another in series and are electrically connected to one another in parallel to form a bandstop filter. Chip inductors and chip capacitors having spaced apart conductive terminals are physically arranged in end-to-end abutting relation to minimize electrical potential between adjacent conductive terminals. The bandstop filter may be hermetically sealed within a biocompatible container for use with an implantable lead or electrode of a medical device. The values of the inductors and the capacitors are selected such that the bandstop filter is resonant at one or more selected frequencies, such as an MRI pulsed frequency.

Abstract: An energy management system facilitates the transfer of high frequency energy coupled into an implanted abandoned lead at a selected RF frequency or frequency band, to an energy dissipating surface. This is accomplished by conductively coupling the implanted abandoned lead to the energy dissipating surface of an abandoned lead cap through an energy diversion circuit including one or more passive electronic network components whose impedance characteristics are at least partially tuned to the implanted abandoned lead's impedance characteristics.