Abstract: A system and method for manufacturing a part in a mold having a mold cavity including a printhead for depositing a first material within the mold cavity, and an injection head for depositing a second material within the mold cavity. A part can be made in the mold cavity by the cooperative use of both injection molding and additive manufacturing steps.

Abstract: A circular heatsink can include a thermally conductive cylinder with an outer circumferential surface and an inner circumferential surface. An emissive and convective and convective surface area can extend radially from the outer circumferential surface. At least one thermally conductive ledge can extend from the inner circumferential surface and be configured to support a planar substrate having heat-generating electrical components. Air flow over the emissive and convective surface area can cause thermal conduction away from the heat-generating electrical components and through the at least one thermally conductive ledge, the thermally conductive cylinder, and the emissive and convective surface area.

Abstract: A method and apparatus for heat-dissipation utilizing a fin assembly including one or more fins organized on a wall or base surface. The fins can extend into a flow of fluid passing along the wall or base surface to convectively cool the fins, which can transfer heat from heat-producing components, such as electronics.

Abstract: A power supply system, including a set of energy storage units, each of the set of energy storage units having a power output, a housing configured to receive the set of energy storage units, an electrical backplane with a backplane power output, and a controller module configured to operate the power output operations of the power supply system.

Abstract: A system and method for manufacturing a part in a mold having a mold cavity including a printhead for depositing a first material within the mold cavity, and an injection head for depositing a second material within the mold cavity. A part can be made in the mold cavity by the cooperative use of both injection molding and additive manufacturing steps.

Abstract: A system and method for manufacturing a part in a mold having a mold cavity including a printhead for depositing a first material within the mold cavity, and an injection head for depositing a second material within the mold cavity. A part can be made in the mold cavity by the cooperative use of both injection molding and additive manufacturing steps.

Abstract: A method and apparatus for heat-dissipation utilizing a fin assembly including one or more fins organized on a wall or base surface. The fins can extend into a flow of fluid passing along the wall or base surface to convectively cool the fins, which can transfer heat from heat-producing components, such as electronics.

Abstract: A circular heatsink can include a thermally conductive cylinder with an outer circumferential surface and an inner circumferential surface. An emissive and convective and convective surface area can extend radially from the outer circumferential surface. At least one thermally conductive ledge can extend from the inner circumferential surface and be configured to support a planar substrate having heat-generating electrical components. Air flow over the emissive and convective surface area can cause thermal conduction away from the heat-generating electrical components and through the at least one thermally conductive ledge, the thermally conductive cylinder, and the emissive and convective surface area.

Abstract: A system and method for manufacturing a part in a mold having a mold cavity including a printhead for depositing a first material within the mold cavity, and an injection head for depositing a second material within the mold cavity. A part can be made in the mold cavity by the cooperative use of both injection molding and additive manufacturing steps.