Patents by Inventor Christopher Muhlstein

Christopher Muhlstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polycrystalline complex-shaped mesoscale components
    Patent number: 8530039
    Abstract: A polycrystalline mesoscale component, formed through a process including filing a mold cavity formed in a photoresist with a mold fill, is provided with an overall length L divided into multiple segments with a second segment extending from a first segment at a nonlinear angle. The first segment has a first segment height H1 and a first segment thickness T1, while the second segment has a second segment height H2 and a second segment thickness T2, with the lesser of H1 and H2 defining a minimum segment height Hmin and the lesser of T1 and T2 defining a minimum segment thickness Tmin. The resultant component has a ratio of L:Hmin:Tmin of 20-80:1:0.5-10 where Hmin is between 5 and 500 microns. In specific instances, the nonlinear angle is acute, the multiple segments are rectilinear in cross section, and a segment thickness has an edge resolution of between 0.1 and 2 microns.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: September 10, 2013
    Assignee: The Penn State Research Foundation
    Inventors: James H. Adair, Mary Frecker, Christopher Muhlstein, Eric Mockensturm, Harriet Black Nembhard, Randy S. Haluck, Abraham Mathew, Nicholas Antolino, Gregory R Hayes, Milton Aguirre, Rebecca Kirkpatrick, Chumpol Yuangyai
  • POLYCRYSTALLINE COMPLEX-SHAPED MESOSCALE COMPONENTS
    Publication number: 20100075170
    Abstract: A polycrystalline mesoscale component is provided that has an overall length L divided into multiple segments with a second segment extending from a first segment at a nonlinear angle. The first segment has a first segment height H1 and a first segment thickness T1, while the second segment has a second segment height H2 and a second segment thickness T1, with the lesser of H1 and H2 defining a minimum segment height Hmin and the lesser of T1 and T2 defining a minimum segment thickness Tmin. The resultant component has a ratio of L:Hmin:Tmin of 20-80:1:0.5-10 where Hmin is between 5 and 500 microns. In specific instances, the nonlinear angle is acute, the multiple segments are rectilinear in cross section, and a segment thickness has an edge resolution of between 0.1 and 2 microns. A process for forming a polycrystalline mesoscale component is provided that includes filling a mold cavity formed in a photoresist with a mold fill.
    Type: Application
    Filed: August 3, 2009
    Publication date: March 25, 2010
    Applicant: The Penn State Research Foundation
    Inventors: James H. Adair, Mary Frecker, Christopher Muhlstein, Eric Mockensturm, Randy S. Haluck, Abraham Mathew, Milton Aguirre, Rebecca Kirkpatrick, Chumpol Yuangyai