Abstract: A fastener (11) in the form of a strip (12) of material in the form of a ring which in plan view is profiled to conform to an annular gap (H) between a first component (A) bounded by the fastener (11) and a second component (B) bounding the fastener (11); the ring member having ends providing a gap (G) in plan view; the strip of material having a first side (14) and a second side (15); and having a series of integral fingers (16-23) spaced along the length of the ring and projecting, in plan view, outwardly from the ring whether from the first side (14), the second side (15), or both sides thereof. In a further version the ring includes a further series of discrete projections formed integrally from the strip and lying around the ring member in between members of the series of fingers.

Abstract: Methods of forming a multilayer circuit comprising: a) forming a patterned array of vias in a plurality of layers of green tape; b) filling the vias in one or more of the green tape layers from (a); c) printing over at least one surface of the green tape layers from step (b) with at least one patterned layer of a thick film composition consisting essentially of: i) electrically conductive powder; ii) an inorganic binder wherein the inorganic binder is selected from TiO2 and any compounds that can generate TiO2 during firing and any one of the following compounds: Sb2O3, Co3O4, PbO, Fe2O3, SnO2, MnO, CuO and mixtures thereof; and iii) an organic medium, ?wherein the total inorganic binder is in the range of 0.6 wt. % to about 2 wt. % of the total composition. d) laminating the printed green tape layers from step (d) to form an assemblage comprising a plurality of unfired interconnected functional layers separated by unfired green tape; and e) cofiring the assemblage from step (d).

Abstract: An apparatus is shown which comprises first and second mating components with a force limiter located between them. The force limiter includes a band of resilient material, with protrusions therealong, and a slip element. The band and the slip element are secured to the first mating component with the band arranged to apply a radial force against the slip element so as to press it against the second mating component. The frictional force between slip element and the second mating component is insufficient to separate the slip element and the band from the first mating component, so any slipping that occurs between the mating components happens at the boundary of the slip element and the second mating component. A desired slip force can be obtained by choosing a slip element with an appropriate coefficient of friction, rather than by varying the dimensions of the components.

Abstract: The present invention is directed to the use of a thick film paste composition comprising, in weight percent total paste composition, materials selected from mixtures of lead iron tungstate niobate solid solutions 30 to 80%, calcined mixtures of barium titanate, lead oxide and fused silica 20 to 70%, barium titanate 30 to 50%, calcined mixtures of barium titanate 30 to 50%, barium titanate and calcined mixtures of barium titanate 30 to 50%, lead oxide and fused silica 50-80%, and a lead germanate glass 3-20%, as a thick film paste via fill composition for use in the formation of multilayer low temperature cofired ceramic circuits.

Abstract: The present invention is directed to a method to produce a co-fired, metallized high dielectric constant ceramic core comprising: providing a precursor green laminate comprising at least one layer of core tape wherein said core tape has a dielectric constant of at least 20; and firing said precursor green laminate. The method is further directed to a method to produce a low-temperature co-fired ceramic structure comprising: providing a precursor green laminate comprising at least one layer of core tape wherein said tape has a dielectric constant of at least 20; firing said precursor green laminate during a first firing to form a high dielectric constant ceramic core; providing one or more layers of metallized low dielectric constant primary tape; laminating one or more layers of said metallized low dielectric constant primary tape to said core; and firing said core and primary tape layers during a second firing.

Abstract: The present invention is directed to a method of to produce a low-temperature co-fired ceramic structure comprising: providing a precursor green laminate comprising at least one layer of core tape wherein said core tape has a dielectric constant of at least 20; providing one or more layers of self-constraining tape; providing one or more layers of primary tape; collating said layers of core tape, self-constraining tape, and primary tape; and laminating and co-firing said layers of core tape, self-constraining tape, and primary tape to form said ceramic structure.

Abstract: This invention relates to a process which produces flat, distortion-free, zero-shrink, low-temperature co-fired ceramic (LTCC) bodies, composites, modules or packages from precursor green (unfired) laminates of three or more different dielectric tape chemistries that are configured in an uniquely or pseudo-symmetrical arrangement in the z-axis of the laminate.

Abstract: This invention relates to a process which produces flat, distortion-free, zero-shrink, low-temperature co-fired ceramic (LTCC) bodies, composites, modules or packages from precursor green (unfired) laminates of three or more different dielectric tape chemistries that are configured in an uniquely or pseudo-symmetrical arrangement in the z-axis of the laminate.

Abstract: This invention relates to a process which produces flat, distortion-free, zero-shrink, low-temperature co-fired ceramic (LTCC) bodies, composites, modules or packages from precursor green (unfired) laminates of three or more different dielectric tape chemistries that are configured in an uniquely or pseudo-symmetrical arrangement in the z-axis of the laminate.

Abstract: This invention relates to a process which produces flat, distortion-free, zero-shrink, low-temperature co-fired ceramic (LTCC) bodies, composites, modules or packages from precursor green (unfired) laminates of three or more different dielectric tape chemistries that are configured in an uniquely or pseudo-symmetrical arrangement in the z-axis of the laminate.

Abstract: The present invention provides to a method for the production of metallized ceramic substrates that demonstrate superior adhesion characteristics when surface mounted components are soldered to their surface metallization(s) and that provide superior stability when the completed circuits are exposed to high-temperature storage conditions.

Abstract: A thick film composition consisting essentially of: a) electrically conductive powder; b) an inorganic binder wherein the inorganic binder is selected from TiO2 and any compounds that can generate TiO2 during firing and any one of the following compounds: Sb2O3, CO3O4, PbO, Fe2O3, SnO2, ZrO2, MnO, CuOx and mixtures thereof; and c) an organic medium.

Abstract: A thick film composition consisting essentially of: a) electrically conductive powder; b) an inorganic binder wherein the inorganic binder is selected from TiO2 and any compounds that can generate TiO2 during firing; and c) an organic medium.

Abstract: A method to produce a distortion-free asymmetrical low-temperature co-fired ceramic structure comprising at least one layer of glass-containing internal constraining tape and at least one layer of glass-containing primary tape wherein the internal constraining tape and the primary tape are laminated to form an asymmetrical laminate and wherein a release layer is deposited on at least one surface of the laminate forming an assembly, wherein the surface is opposite the position of greatest asymmetry of the laminated layers and wherein the assembly is thermally processed producing a structure exhibiting an interactive suppression of x,y shrinkage.