Patents by Inventor Christopher Netzband

Christopher Netzband has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for wet atomic layer etching of copper
    Patent number: 11866831
    Abstract: The present disclosure provides a new wet atomic layer etch (ALE) process for etching copper. More specifically, the present disclosure provides various embodiments of methods that utilize new etch chemistries for etching copper in a wet ALE process. By utilizing the new etch chemistries disclosed herein within a wet ALE process, the present disclosure provides a highly selective etch of copper with monolayer precision.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: January 9, 2024
    Assignee: Tokyo Electron Limited
    Inventors: Christopher Netzband, Paul Abel, Jacques Faguet, Arkalgud Sitaram
  • Methods For Wet Atomic Layer Etching Of Copper
    Publication number: 20230140900
    Abstract: The present disclosure provides a new wet atomic layer etch (ALE) process for etching copper. More specifically, the present disclosure provides various embodiments of methods that utilize new etch chemistries for etching copper in a wet ALE process. By utilizing the new etch chemistries disclosed herein within a wet ALE process, the present disclosure provides a highly selective etch of copper with monolayer precision.
    Type: Application
    Filed: April 20, 2022
    Publication date: May 11, 2023
    Inventors: Christopher Netzband, Paul Abel, Jacques Faguet, Arkalgud Sitaram
  • Method for Etching of Metal
    Publication number: 20230108117
    Abstract: A method of etching a metal includes performing at least two cycles of an etch process. A cycle of the etch process includes: performing a surface modification on an exposed surface of a metal layer over a substrate, performing a hydrogen treatment on the metal layer, and performing a cleaning treatment on the metal layer. The hydrogen treatment forms a layer of reaction products on the metal layer. The cleaning treatment removes the layer of reaction products.
    Type: Application
    Filed: October 4, 2022
    Publication date: April 6, 2023
    Inventors: Sergey Voronin, Qi Wang, Christopher Netzband, Gabriel Gibney, Sang Cheol Han, Peter Biolsi, Arkalgud Sitaram, Christophe Vallee