Abstract: A printing method includes supplying pigmented ink to inkjet printhead having array of dual feed thermal inkjet ejectors, wherein pigmented ink includes an aqueous carrier with pigment particle loading of at least 4 percent by weight and polymer loading of at least 1 percent by weight; ejecting a plurality of maintenance drops of pigmented ink from array of dual feed thermal inkjet ejectors prior to start of printing the image on recording medium; printing the image swath by swath by ejecting printing drops of pigmented ink on recording medium, wherein a plurality of printing swaths are required in order to complete printing of the image; and ejecting a plurality of maintenance drops of pigmented ink from array of dual feed thermal inkjet ejectors after a completion of printing the image on recording medium, wherein no maintenance drops are ejected between the start and the completion of printing of the image.

Abstract: A liquid ejection system includes a liquid ejector having a structure defining a chamber, the chamber including a first surface and a second surface, the first surface including a nozzle orifice; a resistive heater located on the second surface of the chamber opposite the nozzle orifice; a first liquid feed channel and a second liquid feed channel being in fluid communication with the chamber; and a segmented liquid inlet, a first segment of the liquid inlet being in fluid communication with the first liquid feed channel, and a second segment of the liquid inlet being in fluid communication with the second liquid feed channel; and a liquid supply comprising a liquid including a polymer at a loading of at least 2 percent by weight, wherein the polymer has a molecular weight of at least 20,000, and wherein the liquid supply is fluidically connected to the segmented liquid inlet.

Abstract: A liquid ejection system includes a liquid ejector having a structure defining a chamber, the chamber including a first surface and a second surface, the first surface including a nozzle orifice; a resistive heater located on the second surface of the chamber opposite the nozzle orifice; a first liquid feed channel and a second liquid feed channel being in fluid communication with the chamber; and a segmented liquid inlet, a first segment of the liquid inlet being in fluid communication with the first liquid feed channel, and a second segment of the liquid inlet being in fluid communication with the second liquid feed channel; and a liquid supply comprising a liquid including a carrier fluid and a solids content that is greater than 5 percent by weight, wherein the liquid supply is fluidically connected to the segmented liquid inlet.

Abstract: A method for forming a self-aligned hole through a substrate to form a fluid feed passage is provided by initially forming an insulating layer on a first side of a substrate having two opposing sides; and forming a feature on the insulating layer. Next, etch an opening through the insulating layer, such that the opening is physically aligned with the feature on the insulating layer; and coat the feature with a layer of protective material. Patterning the layer of protective material will expose the opening through the insulating layer. Dry etching from the first side of the substrate forms a blind feed hole in the substrate corresponding to the location of the opening in the insulating layer, the blind feed hole including a bottom. Subsequently, grind a second side of the substrate and blanket etch it to form a hole through the entire substrate.

Abstract: A method for forming a self-aligned hole through a substrate to form a fluid feed passage is provided by initially forming an insulating layer on a first side of a substrate having two opposing sides; and forming a feature on the insulating layer. Next, etch an opening through the insulating layer, such that the opening is physically aligned with the feature on the insulating layer; and coat the feature with a layer of protective material. Patterning the layer of protective material will expose the opening through the insulating layer. Dry etching from the first side of the substrate forms a blind feed hole in the substrate corresponding to the location of the opening in the insulating layer, the blind feed hole including a bottom. Subsequently, grind a second side of the substrate and blanket etch it to form a hole through the entire substrate.

Abstract: A method for forming a self-aligned hole through a substrate to form a fluid feed passage is provided by initially forming an insulating layer on a first side of a substrate having two opposing sides; and forming a feature on the insulating layer. Next, etch an opening through the insulating layer, such that the opening is physically aligned with the feature on the insulating layer; and coat the feature with a layer of protective material. Patterning the layer of protective material will expose the opening through the insulating layer. Dry etching from the first side of the substrate forms a blind feed hole in the substrate corresponding to the location of the opening in the insulating layer, the blind feed hole including a bottom. Subsequently, grind a second side of the substrate and blanket etch it to form a hole through the entire substrate.

Abstract: A method for forming a self-aligned hole through a substrate to form a fluid feed passage is provided by initially forming an insulating layer on a first side of a substrate having two opposing sides; and forming a feature on the insulating layer. Next, etch an opening through the insulating layer, such that the opening is physically aligned with the feature on the insulating layer; and coat the feature with a layer of protective material. Patterning the layer of protective material will expose the opening through the insulating layer. Dry etching from the first side of the substrate forms a blind feed hole in the substrate corresponding to the location of the opening in the insulating layer, the blind feed hole including a bottom. Subsequently, grind a second side of the substrate and blanket etch it to form a hole through the entire substrate.