Abstract: Embodiments herein provide for a self-destructing chip including at least a first die and a second die. The first die includes an electronic circuit, and the second die is composed of one or more polymers that disintegrates at a first temperature. The second die defines a plurality of chambers, wherein a first subset of the chambers contain a material that reacts with oxygen in an exothermic manner. A second subset of the chambers contain an etchant to etch materials of the first die. In response to a trigger event, the electronic circuit is configured to expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature, and is configured to release the etchant from the second subset of the chambers to etch the first die.

Abstract: Embodiments herein provide for a self-destructing chip including at least a first die and a second die. The first die includes an electronic circuit, and the second die is composed of one or more polymers that disintegrates at a first temperature. The second die defines a plurality of chambers, wherein a first subset of the chambers contain a material that reacts with oxygen in an exothermic manner. A second subset of the chambers contain an etchant to etch materials of the first die. In response to a trigger event, the electronic circuit is configured to expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature, and is configured to release the etchant from the second subset of the chambers to etch the first die.

Abstract: A method for patterning biomaterials is presented. The biomaterials exhibit biological activity after patterning. The use of bio-compatible imaging materials and solvents allows conventional lithographic patterning methods to be applied to patterning biomolecules. The method allows deposition of multiple layers without subsequent layers affecting earlier laid deposits and can pattern multiple different biomolecules on a single surface.

Abstract: Methods and compositions for obtaining patterned structures comprising fluorine-containing polymeric materials. The fluorine-containing polymeric materials have sufficient fluorine content such that the materials can be patterned using conventional photolithographic/pattern transfer methods and maintain desirable mechanical and physical properties. The patterned structures can be used, for example, in light-emitting devices.

Abstract: A method for patterning biomaterials is presented. The biomaterials exhibit biological activity after patterning. The use of bio-compatible imaging materials and solvents allows conventional lithographic patterning methods to be applied to patterning biomolecules. The method allows deposition of multiple layers without subsequent layers affecting earlier laid deposits and can pattern multiple different biomolecules on a single surface.

Abstract: Methods and compositions for obtaining patterned structures comprising fluorine-containing polymeric materials. The fluorine-containing polymeric materials have sufficient fluorine content such that the materials can be patterned using conventional photolithographic/pattern transfer methods and maintain desirable mechanical and physical properties. The patterned structures can be used, for example, in light-emitting devices.

Abstract: The invention provides polymers, methods of preparing polymers, and compositions that include polymers, wherein said polymers include a plurality of two-carbon repeating units in a polymer chain, wherein one or more of the two-carbon repeating units of the polymer chain have tertiary amine or pyridine-containing substituents; and at least about 10% of the nitrogen atoms of the tertiary amine or pyridine-containing substituents are quaternized with alkyl groups or with an alkyl group that contains one or more ethylene glycol groups. The alkyl or ethoxylated alkyl groups can also be at least partially fluorinated. The polymers can be used to provide antimicrobial surfaces and antifouling coatings.

Abstract: The invention provides polymers, methods of preparing polymers, and compositions that include polymers, wherein said polymers include a plurality of two-carbon repeating units in a polymer chain, wherein one or more of the two-carbon repeating units of the polymer chain have a substituent that is covalently bonded to a semifluorinated alkyl ethoxy moiety, and the semifluorinated alkyl ethoxy moiety is attached to the polymer chain substituent through an ester, amide, ketone, carbamate, amine, or other suitable linking group. The polymers can be used to provide antifouling coatings.

Abstract: The present invention provides compounds of formulae (I), (II), and (III), which can be block copolymers with various substituents and side-chain groups. The side-chains can include semifluorinated alkyl- and PEG-derived groups. The block copolymers can be surface active block copolymers (SABCs) and can be used as antifouling coatings. Coating compositions employing the compounds of the invention and methods for their use are also provided.

Abstract: Novel classes of ionic photoacid generator (PAGs) compounds having relatively environmentally friendly anions with no perfluorooctyl sulfonate (no-PFOS) are provided and photoresist composition that comprise such compounds. The new PAGs produce a photoacid having a short or no perfluoro alkyl chain (ie., no-PFOS) attached to a variety of functional groups. The PAGs of the invention are useful as photoactive component in the chemically amplified resist compositions used for microfabrication.

Abstract: Provided is a process for lithographically patterning a material on a substrate comprising the steps of (a) depositing a radiation sensitive material on the substrate by chemical vapor deposition; (b) selectively exposing the radiation sensitive material to radiation to form a pattern; and (c) developing the pattern using a supercritical fluid (SCF) as a developer. Also disclosed is a microstructure formed by the foregoing process. Also disclosed is a process for lithographically patterning a material on a substrate wherein after steps (a) and (b) above, the pattern is developed using a dry plasma etch. Also disclosed is a microstructure comprising a substrate; and a patterned dielectric layer, wherein the patterned dielectric layer comprises at least one two-dimensional feature having a dimensional tolerance more precise than 7%.

Abstract: Provided is a process for lithographically patterning a material on a substrate comprising the steps of (a) depositing a radiation sensitive material on the substrate by chemical vapor deposition; (b) selectively exposing the radiation sensitive material to radiation to form a pattern; and (c) developing the pattern using a supercritical fluid (SCF) as a developer. Also disclosed is a microstructure formed by the foregoing process. Also disclosed is a process for lithographically patterning a material on a substrate wherein after steps (a) and (b) above, the pattern is developed using a dry plasma etch. Also disclosed is a microstructure comprising a substrate; and a patterned dielectric layer, wherein the patterned dielectric layer comprises at least one two-dimensional feature having a dimensional tolerance more precise than 7%.

Abstract: Processes for patterning radiation sensitive layers are disclosed. In one embodiment, the process includes depositing a radiation sensitive material on a substrate by chemical vapor deposition. The radiation sensitive material is exposed to radiation to form a pattern and the pattern is developed using a supercritical fluid (SCF).

Abstract: Provided is a process for lithographically patterning a material on a substrate comprising the steps of (a) depositing a radiation sensitive material on the substrate by chemical vapor deposition; (b) selectively exposing the radiation sensitive material to radiation to form a pattern; and (c) developing the pattern using a supercritical fluid (SCF) as a developer. Also disclosed is a microstructure formed by the foregoing process. Also disclosed is a process for lithographically patterning a material on a substrate wherein after steps (a) and (b) above, the pattern is developed using a dry plasma etch. Also disclosed is a microstructure comprising a substrate; and a patterned dielectric layer, wherein the patterned dielectric layer comprises at least one two-dimensional feature having a dimensional tolerance more precise than 7%.