Patents by Inventor Christopher P. KOHLER

Christopher P. KOHLER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Two stage methods for processing adhesives and related compositions
    Patent number: 10414953
    Abstract: Methods for forming melt processable, actinic radiation polymerizable and crosslinkable adhesives are described. In certain versions, the adhesives or pre-adhesive compositions include two initiators and are polymerized and/or crosslinked by exposure to actinic radiation such as UV light or electron beam radiation. Also described are pre-adhesive compositions including polymerizable monomers, articles including the adhesives, and various methods and systems related to the adhesives and their application. In addition, various apparatuses are described for polymerizing or crosslinking the compositions.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: September 17, 2019
    Assignee: Avery Dennison Corporation
    Inventors: Eric L. Bartholomew, William L. Bottorf, Kyle R. Heimbach, Brandon S. Miller, Michael T. Waterman, Michael T. Zajaczkowski, Qiang Luo, Andrew P. Full, Christopher P. Kohler
  • Two Stage Methods for Processing Adhesives and Related Compositions
    Publication number: 20170240783
    Abstract: Methods for forming melt processable, actinic radiation polymerizable and crosslinkable adhesives are described. In certain versions, the adhesives or pre-adhesive compositions include two initiators and are polymerized and/or crosslinked by exposure to actinic radiation such as UV light or electron beam radiation. Also described are pre-adhesive compositions including polymerizable monomers, articles including the adhesives, and various methods and systems related to the adhesives and their application. In addition, various apparatuses are described for polymerizing or crosslinking the compositions.
    Type: Application
    Filed: February 20, 2017
    Publication date: August 24, 2017
    Inventors: Eric L. BARTHOLOMEW, William L. BOTTORF, Kyle R. HEIMBACH, Brandon S. MILLER, Michael T. WATERMAN, Michael T. ZAJACZKOWSKI, Qiang LUO, Andrew P. FULL, Christopher P. KOHLER