Patents by Inventor Christopher P. Steffani

Christopher P. Steffani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Processing a printed wiring board by single bath electrodeposition
    Patent number: 7846317
    Abstract: A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: December 7, 2010
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Michael P. Meltzer, Christopher P. Steffani, Ray A. Gonfiotti
  • Processing a printed wiring board by single bath electrodeposition
    Publication number: 20030150742
    Abstract: A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
    Type: Application
    Filed: February 24, 2003
    Publication date: August 14, 2003
    Applicant: The Regents of the University of California
    Inventors: Michael P. Meltzer, Christopher P. Steffani, Ray A. Gonfiotti
  • Processing a printed wiring board by single bath electrodeposition
    Patent number: 6547946
    Abstract: A method of processing a printed wiring board by single bath electrodeposition. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from the bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: April 15, 2003
    Assignee: The Regents of the University of California
    Inventors: Michael P. Meltzer, Christopher P. Steffani, Ray A. Gonfiotti
  • Single bath electrodeposition
    Publication number: 20010050179
    Abstract: A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
    Type: Application
    Filed: March 16, 2001
    Publication date: December 13, 2001
    Applicant: The Regents of the University of California
    Inventors: Michael P. Meltzer, Christopher P. Steffani, Ray A. Gonfiotti