Abstract: A film for adhering to a molding paste composite during its manufacture, said film being formed from a blend of a film forming polyamide resin and at least one release agent material selected from the group consisting of N, N' ethylene bis amides of the formula R.sub.1 --CO--NH--CH.sub.2 --CH.sub.2 --NH--CO--R.sub.2 wherein R.sub.1 is an aliphatic hydrocarbon chain of about 14 to about 42 carbon atoms, and R.sub.2 is a hydrogen atom or an aliphatic hydrocarbon of about 14 to about 42 carbon atoms, wherein the release agent material is present in an amount such that after the paste composite is formed, substantially all of the film can be removed from the surface of the composite. Also described are processes for making sheet molding and thick molding composites using such films.