Patents by Inventor Christopher Penny

Christopher Penny has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of filling openings in a component
    Patent number: 8087565
    Abstract: A process for filling openings, including blind holes, through-holes, and cavities, in high temperature components. The process entails forming a powder mixture by mixing particles of at least a base alloy and a second alloy that contains a sufficient amount of a melting point depressant to have a lower melting temperature than the base alloy. The powder mixture is combined with a binder and compacted to form a compacted preform, which is then heated to remove the binder and form a rigid sintered preform. The sintered preform is produced, or optionally is further shaped, to have a cross-sectional shape and dimensions to achieve a clearance of up to 200 micrometers with the opening, after which the preform is placed in the opening and diffusion bonded within the opening to form a brazement comprising the particles of the base alloy dispersed in a matrix formed by the second alloy.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: January 3, 2012
    Assignee: General Electric Company
    Inventors: Srikanth Chandrudu Kottilingam, Charles Gitahi Mukira, Warren Martin Miglietti, Arthur S. Peck, Christopher Penny, Yan Cui, Steven Rauch
  • PROCESS OF FILLING OPENINGS IN A COMPONENT
    Publication number: 20100059573
    Abstract: A process for filling openings, including blind holes, through-holes, and cavities, in high temperature components. The process entails forming a powder mixture by mixing particles of at least a base alloy and a second alloy that contains a sufficient amount of a melting point depressant to have a lower melting temperature than the base alloy. The powder mixture is combined with a binder and compacted to form a compacted preform, which is then heated to remove the binder and form a rigid sintered preform. The sintered preform is produced, or optionally is further shaped, to have a cross-sectional shape and dimensions to achieve a clearance of up to 200 micrometers with the opening, after which the preform is placed in the opening and diffusion bonded within the opening to form a brazement comprising the particles of the base alloy dispersed in a matrix formed by the second alloy.
    Type: Application
    Filed: September 8, 2008
    Publication date: March 11, 2010
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Srikanth Chandrudu Kottilingam, Charles Gitahi Mukira, Warren Martin Miglietti, Arthur S. Peck, Christopher Penny, Yan Cui, Steven Rauch