Abstract: According to various embodiments, an article including a glass or glass-ceramic substrate having a first major surface and a second major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, the via defining a first axial portion, a third axial portion, and a second axial portion disposed between the first and third axial portions. The article further includes a helium hermetic adhesion layer disposed on the interior surface in the first and/or third axial portions and a metal connector disposed within the via, the metal connector being adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, the via has a maximum diameter, ?max, of less than or equal to 30 ?m, and the axial length, L, and the maximum diameter, ?max, satisfy an equation: L ? max > 20 ? ? micron 1 / 2 .

Abstract: A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

Abstract: According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 ?m at the first major surface.

Abstract: The optical-electrical interconnection device comprises a glass support member with front-end and back-end portions that define a plane and an aperture. A cantilever member extends from the back-end portion into the aperture. The cantilever member supports an interconnection optical waveguide. The cantilever member comprises a bend region that causes a front-end section of the cantilever member to extend out of the plane. The front-end section is flexible, which allows for the interconnection optical waveguide to be aligned and optically coupled to a device waveguide of an optical-electrical device. A photonic assembly is formed using the optical-electrical interconnection device and at least one optical-electrical device. Methods of forming optical and electrical interconnections using the optical-electrical interconnection device are also disclosed.

Abstract: Electronics packages that incorporate components such as glass-based interposer assemblies are disclosed, as well as methods of forming thereof. A method includes bonding a glass-based substrate to a carrier, applying a metallization layer and/or a dielectric layer over the glass-based substrate to obtain a layered structure bonded to the carrier, removing sections of the layered structure such that portions of the layered structure remain on the carrier with a space between each thereof, attaching one or more dies to the portions, dispensing an underfill material between the glass-based substrate and the dies to obtain assemblies bonded to the carrier, encapsulating the assemblies with a polymeric material to obtain encapsulated assemblies, removing the carrier from the encapsulated assemblies to expose a back side of the encapsulated assemblies, and applying second metallization layers and second dielectric layers over the back side of the encapsulated assemblies to form the glass-based structures.

Abstract: An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10?8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of ?40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10?8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.

Abstract: Methods of continuous fabrication of features in flexible substrates are disclosed. In one embodiment, a method of fabricating features in a substrate web includes providing the substrate web arranged in a first spool on a first spool assembly, advancing the substrate web from the first spool and through a laser processing assembly comprising a laser, and creating a plurality of defects within the substrate web using the laser. The method further includes advancing the substrate web through an etching assembly and etching the substrate web at the etching assembly to remove glass material at the plurality of defects, thereby forming a plurality of features in the substrate web. The method further includes rolling the substrate web into a final spool.

Abstract: The optical-electrical interconnection device comprises a glass support member with front-end and back-end portions that define a plane and an aperture. A cantilever member extends from the back-end portion into the aperture. The cantilever member supports an interconnection optical waveguide. The cantilever member comprises a bend region that causes a front-end section of the cantilever member to extend out of the plane. The front-end section is flexible, which allows for the interconnection optical waveguide to be aligned and optically coupled to a device waveguide of an optical-electrical device. A photonic assembly is formed using the optical-electrical interconnection device and at least one optical-electrical device. Methods of forming optical and electrical interconnections using the optical-electrical interconnection device are also disclosed.

Abstract: Methods and apparatus are provide for an interposer for interconnecting one or more semiconductor chips with an organic substrate in a semiconductor package, the interposer including: a first glass substrate having first and second opposing major surfaces, the first glass substrate having a first coefficient of thermal expansion (CTE1); a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.

Abstract: Methods and apparatus are provide for an interposer for interconnecting one or more semiconductor chips with an organic substrate in a semiconductor package, the interposer including: a first glass substrate having first and second opposing major surfaces, the first glass substrate having a first coefficient of thermal expansion (CTE1); a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.