Patents by Inventor Christopher R. Knafelc

Christopher R. Knafelc has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8720684
    Abstract: A packaging system and a method of packaging a plurality of floor panels in a box includes floor panels having a top layer and a bottom layer. The top layer has a top surface with a visible decorative pattern and a bottom surface adhered to a top surface of the bottom layer such that the bottom layer is offset from the top layer in a direction of length and width and a marginal end portion of the top surface of the bottom layer and a marginal end portion of the bottom surface of the top layer is exposed. At least one of the marginal end portions has an adhesive. The floor panels are stacked in the box in pairs. Each of the pairs is stacked such that the top surfaces of the top layers of each of the pairs of the floor panels are facing each other.
    Type: Grant
    Filed: August 19, 2010
    Date of Patent: May 13, 2014
    Assignee: AWI Licensing Company
    Inventors: Richard H. Balmer, Shih Chung Lee, Dung V. Dao, Christopher R. Knafelc, Heath E. Harrington, Kean M. Anspach, Michael E. Buckwalter, John R. Eshbach, Jr.
  • Publication number: 20110042252
    Abstract: A packaging system and a method of packaging a plurality of floor panels in a box includes floor panels having a top layer and a bottom layer. The top layer has a top surface with a visible decorative pattern and a bottom surface adhered to a top surface of the bottom layer such that the bottom layer is offset from the top layer in a direction of length and width and a marginal end portion of the top surface of the bottom layer and a marginal end portion of the bottom surface of the top layer is exposed. At least one of the marginal end portions has an adhesive. The floor panels are stacked in the box in pairs. Each of the pairs is stacked such that the top surfaces of the top layers of each of the pairs of the floor panels are facing each other.
    Type: Application
    Filed: August 19, 2010
    Publication date: February 24, 2011
    Inventors: Richard H. Balmer, Shih Chung Lee, Dung V. Dao, Christopher R. Knafelc, Heath E. Harrington, Kean M. Anspach, Michael E. Buckwalter, John R. Eshbach, JR.