Patents by Inventor CHRISTOPHER R. MACK
CHRISTOPHER R. MACK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9653331Abstract: Improvements in a single and dual stage wafer cushion is disclosed where the wafer cushion can use an edge hinge as a single first stage cushion and a second mid span hinge for the dual stage wafer cushion. This dual stage design gives two distinctly different cushioning forces as opposed to using a single stage design where the force is linear with the amount of compression that is being applied to the outer surfaces of the wafer cushion. The outside edge of the ring provides the greatest expansion such that only the outer edge of the ring makes contact with the outer edge of a wafer. The wafer cushion is a material that flexes and absorbs shocks before the shock is transferred to the wafer stack. The material minimizes debris or contaminants from embedding into the wafer cushion and also prevents sheading of material from the wafer cushion.Type: GrantFiled: February 16, 2011Date of Patent: May 16, 2017Assignee: Texchem Advanced Products Incorporated SDN. BHD.Inventors: James D Pylant, Christopher R Mack, Alan L Waber, David A Miller
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Publication number: 20160218027Abstract: Improvements in a single and dual stage wafer cushion is disclosed where the wafer cushion can use an edge hinge as a single first stage cushion and a second mid span hinge for the dual stage wafer cushion. This dual stage design gives two distinctly different cushioning forces as opposed to using a single stage design where the force is linear with the amount of compression that is being applied to the outer surfaces of the wafer cushion. The outside edge of the ring provides the greatest expansion such that only the outer edge of the ring makes contact with the outer edge of a wafer. The wafer cushion is a material that flexes and absorbs shocks before the shock is transferred to the wafer stack. The material minimizes debris or contaminants from embedding into the wafer cushion and also prevents sheading of material from the wafer cushion.Type: ApplicationFiled: December 29, 2015Publication date: July 28, 2016Inventors: James D. Pylant, Christopher R. Mack, Alan L. Waber, David A. Miller
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Patent number: 9224627Abstract: Improvements in a single and dual stage wafer cushion is disclosed where the wafer cushion can use an edge hinge as a single first stage cushion and a second mid span hinge for the dual stage wafer cushion. This dual stage design gives two distinctly different cushioning forces as opposed to using a single stage design where the force is linear with the amount of compression that is being applied to the outer surfaces of the wafer cushion. The outside edge of the ring provides the greatest expansion such that only the outer edge of the ring makes contact with the outer edge of a wafer. The wafer cushion is a material that flexes and absorbs shocks before the shock is transferred to the wafer stack. The material minimizes debris or contaminants from embedding into the wafer cushion and also prevents sheading of material from the wafer cushion.Type: GrantFiled: June 29, 2011Date of Patent: December 29, 2015Assignee: TEXCHEM ADVANCED PRODUCTS INCORPORATED SDN BHDInventors: James D Pylant, Christopher R Mack, Alan L Waber, David A Miller
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Publication number: 20140034548Abstract: Improvements in a semiconductor wafer container for reducing movement of semiconductor wafers within a wafer carrier using flexible wall segments, panels or flexible inserts in the base member's main inner containment diameter. These walls allow a vertical containment surface to move and capture the entire stack of wafers rather than a few wafers. The surface that contacts the wafers moves uniformly inward. The wafer stack is secured by reducing or eliminating the gap between the wafer container and the wafer stack. Further improvements include the addition of a ramped engagement surfaces in the top and/or bottom cover that provides mechanical advantage for easier assembly of the top and bottom cover. This design also allows for automated loading and unloading of the wafer stack because once the top cover is removed, the flexible walls spring back outward. Thus providing a small gap in which to freely remove the wafers.Type: ApplicationFiled: October 15, 2013Publication date: February 6, 2014Applicant: TEXCHEM ADVANCED PRODUCTS INCORPORATED SDN BHDInventors: JAMES D. PYLANT, ALAN L. WABER, CHRISTOPHER R. MACK
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Patent number: 8556079Abstract: Improvements in a semiconductor wafer container for reducing movement of semiconductor wafers within a wafer carrier using flexible wall segments, panels or flexible inserts in the base member's main inner containment diameter. These walls allow a vertical containment surface to move and capture the entire stack of wafers rather than a few wafers. The surface that contacts the wafers moves uniformly inward. The wafer stack is secured by reducing or eliminating the gap between the wafer container and the wafer stack. Further improvements include the addition of a ramped engagement surfaces in the top and/or bottom cover that provides mechanical advantage for easier assembly of the top and bottom cover. This design also allows for automated loading and unloading of the wafer stack because once the top cover is removed, the flexible walls spring back outward. Thus providing a small gap in which to freely remove the wafers.Type: GrantFiled: March 29, 2010Date of Patent: October 15, 2013Assignee: Texchem Advanced Products Incorporated Sdn BhdInventors: James D Pylant, Alan L Waber, Christopher R Mack
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Publication number: 20120205282Abstract: Improvements in a single and dual stage wafer cushion is disclosed where the wafer cushion can use an edge hinge as a single first stage cushion and a second mid span hinge for the dual stage wafer cushion. This dual stage design gives two distinctly different cushioning forces as opposed to using a single stage design where the force is linear with the amount of compression that is being applied to the outer surfaces of the wafer cushion. The outside edge of the ring provides the greatest expansion such that only the outer edge of the ring makes contact with the outer edge of a wafer. The wafer cushion is a material that flexes and absorbs shocks before the shock is transferred to the wafer stack. The material minimizes debris or contaminants from embedding into the wafer cushion and also prevents sheading of material from the wafer cushion.Type: ApplicationFiled: June 29, 2011Publication date: August 16, 2012Applicant: TEXCHEM ADVANCED PRODUCTS INCORPORATED SDN BHDInventors: JAMES D. PYLANT, CHRISTOPHER R. MACK, ALAN L. WABER, DAVID A. MILLER
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Publication number: 20110180451Abstract: Improvements in a single and dual stage wafer cushion is disclosed where the wafer cushion can use an edge hinge as a single first stage cushion and a second mid span hinge for the dual stage wafer cushion. This dual stage design gives two distinctly different cushioning forces as opposed to using a single stage design where the force is linear with the amount of compression that is being applied to the outer surfaces of the wafer cushion. The outside edge of the ring provides the greatest expansion such that only the outer edge of the ring makes contact with the outer edge of a wafer. The wafer cushion is a material that flexes and absorbs shocks before the shock is transferred to the wafer stack. The material minimizes debris or contaminants from embedding into the wafer cushion and also prevents sheading of material from the wafer cushion.Type: ApplicationFiled: February 16, 2011Publication date: July 28, 2011Applicant: TEXCHEM ADVANCED PRODUCTS INCORPORATED SDN. BHD., PENANG MALAYSIAInventors: JAMES D. PYLANT, CHRISTOPHER R. MACK, ALAN L. WABER, DAVID A. MILLER
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Publication number: 20100236977Abstract: Improvements in a semiconductor wafer container for reducing movement of semiconductor wafers within a wafer carrier using flexible wall segments, panels or flexible inserts in the base member's main inner containment diameter. These walls allow a vertical containment surface to move and capture the entire stack of wafers rather than a few wafers. The surface that contacts the wafers moves uniformly inward. The wafer stack is secured by reducing or eliminating the gap between the wafer container and the wafer stack. Further improvements include the addition of a ramped engagement surfaces in the top and/or bottom cover that provides mechanical advantage for easier assembly of the top and bottom cover. This design also allows for automated loading and unloading of the wafer stack because once the top cover is removed, the flexible walls spring back outward. Thus providing a small gap in which to freely remove the wafers.Type: ApplicationFiled: March 29, 2010Publication date: September 23, 2010Applicant: TEXCHEM ADVANCED PRODUCTS INCORPORATED SDN. BHD.Inventors: JAMES D. PYLANT, ALAN L. WABER, CHRISTOPHER R. MACK