Abstract: An electronic device includes a vertical-support-element with first and second edges having first and second reentrant profiles, respectively. The first reentrant profile includes first conformal semiconductor and dielectric layers, and a conformal conductive top-gate. A first electrode contacts a first portion of the first conformal semiconductor layer over the top of the vertical-support-element. A second electrode, adjacent to the first edge, contacts a second portion of the first conformal semiconductor layer not over the vertical-support-element. The second reentrant profile includes a conformal conductive bottom-gate, and second conformal dielectric and semiconductor layers. A third electrode, adjacent to the second edge, contacts the second semiconductor layer not over the vertical-support-element. A fourth electrode, over the vertical-support-element, contacts the second semiconductor layer.

Abstract: An electronic device includes a vertical-support-element with first and second edges having first and second reentrant profiles, respectively. The first reentrant profile includes first conformal semiconductor and dielectric layers, and a conformal conductive top-gate. A first electrode contacts a first portion of the first conformal semiconductor layer over the top of the vertical-support-element. A second electrode, adjacent to the first edge, contacts a second portion of the first conformal semiconductor layer not over the vertical-support-element. The second reentrant profile includes a conformal conductive bottom-gate, and second conformal dielectric and semiconductor layers. A third electrode, adjacent to the second edge, contacts the second semiconductor layer not over the vertical-support-element. A fourth electrode, over the vertical-support-element, contacts the second semiconductor layer.

Abstract: A method of making a micro-wire circuit structure adapted for wrapping includes providing a display and a flexible substrate. The flexible substrate includes a plurality of electrically conductive micro-wires on, in, or adjacent to a common side of the flexible substrate and forming micro-wire electrodes in a touch portion of the flexible substrate. One or more electrical circuits is located on or in a circuit portion of the flexible substrate and one or more micro-wires electrically connects the one or more electrical circuits to corresponding micro-wire electrodes. The flexible substrate is located in relation to the display with the touch portion located adjacent to a display viewing side, the circuit portion located adjacent to a display back side, and an edge portion of the flexible substrate wrapping around a display edge from the display viewing side to the display back side.

Abstract: An electronic component includes a first transistor on a substrate. The first transistor includes a first source, a first drain, a first gate dielectric, a first gate, and a first semiconductor channel having a first length. At least a portion of the first semiconductor channel extends in a direction parallel to the substrate. A vertical-support-element on the substrate has a first reentrant profile. A second transistor includes a second source, a second drain, a second gate dielectric, and a second gate having a second semiconductor channel. At least a portion of the second semiconductor channel extends in a direction orthogonal to the substrate in the first reentrant profile of the vertical-support-element.

Abstract: A method of making a micro-wire circuit structure adapted for wrapping includes providing a display and a flexible substrate. The flexible substrate includes a plurality of electrically conductive micro-wires on, in, or adjacent to a common side of the flexible substrate and forming micro-wire electrodes in a touch portion of the flexible substrate. One or more electrical circuits is located on or in a circuit portion of the flexible substrate and one or more micro-wires electrically connects the one or more electrical circuits to corresponding micro-wire electrodes. The flexible substrate is located in relation to the display with the touch portion located adjacent to a display viewing side, the circuit portion located adjacent to a display back side, and an edge portion of the flexible substrate wrapping around a display edge from the display viewing side to the display back side.

Abstract: A micro-wire circuit structure adapted for wrapping includes a display and a flexible substrate. The flexible substrate includes a plurality of electrically conductive micro-wires formed on, in, or adjacent to a common side of the flexible substrate. One or more electrical circuits is located on or in a circuit portion of the flexible substrate and electrically connect to corresponding micro-wire electrodes in a touch portion of the flexible substrate. The flexible substrate is located in relation to the display with the touch portion located adjacent to a display viewing side, the circuit portion located adjacent to a display back side, and an edge portion of the flexible substrate wrapping around a display edge side from the display viewing side to the display back side.

Abstract: An inkjet printhead includes an array of resistive heaters; an array of nozzles associated with the array of resistive heaters; a heater voltage input for providing a heater voltage; a fire control pulse input for providing a fire control pulse having a first pulsewidth for controlling a length of time that current from the heater voltage input is allowed to pass through at least one of the resistive heaters; and a protective circuit configured to receive the fire control pulse from the fire control pulse input, and to override the fire control pulse if the first pulsewidth is greater than or equal to a predetermined length of time.

Abstract: A method of operating an inkjet printing system includes turning a heater voltage power source providing drop generation power to an inkjet printhead on or off under direction of a controller; providing a fire control pulse for setting a duration of passage of current from the heater voltage power source through one or more resistive heaters for generation of one or more drops of ink under direction of the controller; inputting the fire control pulse into a protective circuit; and overriding the fire control pulse in the setting of the duration of passage of current from the power source through the one or more resistive heaters if the pulsewidth of the fire control pulse is greater than or equal to a predetermined length of time.

Abstract: An inkjet printhead includes an array of resistive heaters; an array of nozzles associated with the array of resistive heaters; a heater voltage input for providing a heater voltage; a fire control pulse input for providing a fire control pulse having a first pulsewidth for controlling a length of time that current from the heater voltage input is allowed to pass through at least one of the resistive heaters; and a protective circuit configured to receive the fire control pulse from the fire control pulse input, and to override the fire control pulse if the first pulsewidth is greater than or equal to a predetermined length of time.

Abstract: A printer includes a printhead die including liquid ejectors separated by walls. Each liquid ejector includes a nozzle orifice and an associated drop forming mechanism. First and second liquid feed channels, extending in opposite directions, are in fluid communication with each liquid ejector. A liquid inlet includes a plurality of first and second segments in fluid communication with the first liquid feed channels and the second liquid feed channels, respectively. The first and second segments are located on opposite sides of the nozzle orifice. For a given liquid ejector, both of the first and second segments are directly in line with the liquid ejector. An electrical lead extends from each drop forming mechanism toward an edge of the printhead die. At least one of the electrical leads is positioned between neighboring segments of at least one of the first and second segments of the liquid inlet.

Abstract: A liquid ejector includes a structure defining a plurality of chambers with one of the chambers including a first and second surface. The first surface includes a nozzle orifice. A drop forming mechanism is located on the second surface of the chamber opposite the nozzle orifice. First and second liquid feed channels are in fluid communication with the chamber. First and second segments of a segmented liquid inlet are in fluid communication with the first and second liquid feed channels, respectively. The first and second segments of the segmented liquid inlet are also in fluid communication with another one of the plurality of chambers. Liquid is provided to the chamber through the first and second liquid feed channels from the segmented liquid inlet. A drop of the liquid is ejected through the nozzle orifice of the chamber by operating the drop forming mechanism.

Abstract: A method of characterizing an array of resistive heaters, a first resistive heater of the array having a nominal sheet resistance, a first nominal length and a first nominal width, the method includes (a) providing a first configuration test resistor disposed proximate the first resistive heater, the first configuration test resistor including a second nominal length and a second nominal width, wherein the second nominal length is different from the first nominal length; (b) measuring a resistance of the first resistive heater; (c) measuring a resistance of the first configuration test resistor; and (d) determining the actual sheet resistance and the actual length of the first resistive heater based on the measured resistances of the first resistive heater and the first configuration test resistor.

Abstract: A method of characterizing an array of resistive heaters, a first resistive heater of the array having a nominal sheet resistance, a first nominal length and a first nominal width, the method includes (a) providing a first configuration test resistor disposed proximate the first resistive heater, the first configuration test resistor including a second nominal length and a second nominal width, wherein the second nominal length is different from the first nominal length; (b) measuring a resistance of the first resistive heater; (c) measuring a resistance of the first configuration test resistor; and (d) determining the actual sheet resistance and the actual length of the first resistive heater based on the measured resistances of the first resistive heater and the first configuration test resistor.

Abstract: An inkjet printhead includes an array of drop ejectors, a first drop ejector of the array including a first resistive heater having a first nominal length and a first nominal width; and a first configuration test resistor disposed proximate the first resistive heater, the first configuration test resistor including a second nominal length and a second nominal width, wherein the second nominal length is different from the first nominal length.

Abstract: A printer includes a printhead die including liquid ejectors separated by walls. Each liquid ejector includes a nozzle orifice and an associated drop forming mechanism. First and second liquid feed channels, extending in opposite directions, are in fluid communication with each liquid ejector. A liquid inlet includes a plurality of first and second segments in fluid communication with the first liquid feed channels and the second liquid feed channels, respectively. The first and second segments are located on opposite sides of the nozzle orifice. For a given liquid ejector, both of the first and second segments are directly in line with the liquid ejector. An electrical lead extends from each drop forming mechanism toward an edge of the printhead die. At least one of the electrical leads is positioned between neighboring segments of at least one of the first and second segments of the liquid inlet.

Abstract: A printhead module includes a substrate, a plurality of drop ejector arrays, and electronic circuitry. The substrate includes a butting edge extending in a first direction along the substrate. The plurality of drop ejector arrays extends substantially parallel to the butting edge of the substrate with a first drop ejector array of the plurality of drop ejector arrays being closest to the butting edge of the substrate. A portion of the electronic circuitry is disposed between the first drop ejector array and the butting edge of the substrate.

Abstract: A liquid ejector is provided that includes a structure defining a plurality of chambers with one of the plurality of chambers including a first surface and a second surface. The first surface includes a nozzle orifice. A drop forming mechanism is located on the second surface of the chamber opposite the nozzle orifice. A first liquid feed channel and a second liquid feed channel are in fluid communication with the chamber. A first segment of a segmented liquid inlet is in fluid communication with the first liquid feed channel and a second segment of the segmented liquid inlet is in fluid communication with the second liquid feed channel. The first segment of the segmented liquid inlet is also in fluid communication with another one of the plurality of chambers and the second segment of the liquid inlet is also in fluid communication with another one of the plurality of chambers.

Abstract: A liquid ejector includes a structure defining a chamber. The chamber includes a first surface and a second surface. The first surface includes a nozzle orifice. A drop forming mechanism is located on the second surface of the chamber opposite the nozzle orifice. A first liquid feed channel and a second liquid feed channel are in fluid communication with the chamber. A first segment of a segmented liquid inlet is in fluid communication with the first liquid feed channel and a second segment of the segmented liquid inlet is in fluid communication with the second liquid feed channel.

Abstract: A fluid-ejecting device with simplified connectivity is disclosed herein. According to an embodiment of the present invention, a common lead is provided such that a plurality of electrical contacts on a fluid-ejecting chip are connected to the common lead, which is located on a single-layer-flex circuit. Because a common lead is provided at an edge of the single-layer-flex circuit adjacent the fluid-ejecting chip, fewer signals need to be routed through the single-layer-flex circuit to such edge, thereby reducing the complexity of such circuit. Further, bond sites at the edge of the single-layer-flex circuit adjacent the fluid-ejecting device are arranged in a manner that minimizes the required length of wire bonds for connecting such contacts to the contacts on the fluid-ejecting chip.

Abstract: A printhead module includes a substrate, a plurality of drop ejector arrays, and electronic circuitry. The substrate includes a butting edge extending in a first direction along the substrate. The plurality of drop ejector arrays extends substantially parallel to the butting edge of the substrate with a first drop ejector array of the plurality of drop ejector arrays being closest to the butting edge of the substrate. A portion of the electronic circuitry is disposed between the first drop ejector array and the butting edge of the substrate.