Abstract: A shunt resistor has a substrate having electrically conductive structures to carry current in a current path, a resistive portion in electrical contact with the electrically conductive structures, and one or more canceling inductance leads electrically connected to the electrically conductive structures and the resistive portion, the one or more canceling inductance configured to cancel inductive effects in a voltage measurement across the resistive portion. A modular tip interconnect has a connector at a first end of the interconnect configured to connect to a probe tip of a test and measurement instrument, and the above shunt resistor located at a second end of the interconnect configured to connect to a device under test (DUT).

Abstract: A probe, including a first input configured to receive a first input signal, a second input configured to receive a second input signal, a first cable connected to the first input, a second cable connected to the second input, an electronically adjustable delay connected to the first cable, the electronically adjustable delay configured to delay the first input signal to remove a skew between the first input signal and the second input signal, and an amplifier configured to receive the first input signal from the electronically adjustable delay and a second input signal.

Abstract: A probe, including a first input configured to receive a first input signal, a second input configured to receive a second input signal, a first cable connected to the first input, a second cable connected to the second input, an electronically adjustable delay connected to the first cable, the electronically adjustable delay configured to delay the first input signal to remove a skew between the first input signal and the second input signal, and an amplifier configured to receive the first input signal from the electronically adjustable delay and a second input signal.