Abstract: The present disclosure relates to compounds of Formula I: and pharmaceutically acceptable salts thereof, pharmaceutical compositions thereof, useful in the treatment of treating viral infections, for example, coronaviridae infections.

Abstract: Operating a gaseous fuel engine system includes detecting preignition in one or more of a plurality of cylinders based on a monitored cylinder pressure during combustion of a gaseous fuel such as a gaseous hydrogen fuel. Operating a gaseous fuel engine system also includes reducing a fuel injection amount for the one or more of the plurality of cylinders to a derated fuel injection amount that is based on a timing of the detected preignition. Fuel injection amount may be reduced to a greater relative extent if detected preignition is early, and to a lesser relative extent if detected preignition is later, in an engine cycle. Related apparatus and control logic is also disclosed.

Abstract: A beverage maker platen overflow sensing system is disclosed. The sensing system includes a process control board (PCB) in communication with solenoid valves of a manifold, the solenoid valves controlling the flow of hot water (e.g., for brewing coffee or tea) into a server positioned in a platen of the beverage maker. The PCB further includes an overflow detection circuit connected to the solenoid valves. Two signal probes are positioned near the forward edge of the platen. Similarly, ground probes are positioned in the platen below the signal probes and providing a ground path to the PCB. The overflow detection circuit generates an electrical signal between the signal probes and detects an overflow state when fluid in the platen grounds the signal between the signal probes and the ground probes. While the overflow persists, the overflow detection circuit ceases the water flow by electrically signaling the solenoid valves to close.

Abstract: A beverage maker platen overflow sensing system is disclosed. The sensing system includes a process control board (PCB) in communication with solenoid valves of a manifold, the solenoid valves controlling the flow of hot water (e.g., for brewing coffee or tea) into a server positioned in a platen of the beverage maker. The PCB further includes an overflow detection circuit connected to the solenoid valves. Two signal probes are positioned near the forward edge of the platen. Similarly, ground probes are positioned in the platen below the signal probes and providing a ground path to the PCB. The overflow detection circuit generates an electrical signal between the signal probes and detects an overflow state when fluid in the platen grounds the signal between the signal probes and the ground probes. While the overflow persists, the overflow detection circuit ceases the water flow by electrically signaling the solenoid valves to close.

Abstract: Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.

Abstract: Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.

Abstract: Placing integrated circuit devices using a perturbation is described. In one example, a testing platform has a circuit board. A socket is on the board for receiving and connecting to an integrated circuit package. The socket has an array of pins to engage connection bumps on a surface of the package and a biasing feature to guide the package into alignment with the pins of the socket. A perturbation source induces movement of the package into alignment with the pins of the socket.

Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Abstract: Placing integrated circuit devices using a perturbation is described. In one example, a testing platform has a circuit board. A socket is on the board for receiving and connecting to an integrated circuit package. The socket has an array of pins to engage connection bumps on a surface of the package and a biasing feature to guide the package into alignment with the pins of the socket. A perturbation source induces movement of the package into alignment with the pins of the socket.

Abstract: An apparatus to clean an electronic device may include a head structure having a first surface adapted to face a body to be cleaned, and a plurality of supply openings and return openings on the first surface. At least a portion of the supply openings and return openings are positioned as alternating rows of supply openings and return openings. The supply openings are larger in area than the return openings in at least a majority of the alternating rows. The supply openings and the return openings are adapted to transmit at least one of a gas and a liquid therethrough. The head structure is adapted to permit the transmission of at least one of a gas and a liquid through the supply openings and at the same time the head structure is also adapted to permit the transmission of at least one of a gas and a liquid through the return openings. Other embodiments are described and claimed.

Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.