Patents by Inventor Christopher R. Stroili

Christopher R. Stroili has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Slot antenna assembly with tapered feedlines and shaped aperture
    Patent number: 11749897
    Abstract: A slot antenna includes a substrate having a first side and a second side, a first conductive layer on the first side of the substrate, and a second conductive layer on the second side of the substrate. A first aperture is in the first conductive layer, a second aperture is in the first conductive layer, a first slotline is in the first conductive layer and in communication with the first aperture, and a second slotline is in the first conductive layer and in communication with the second aperture. A third aperture can be in the second conductive layer. A plurality of vias can be in the substrate and surrounding at least a portion of a region including the first aperture, the second aperture, the first slotline, and the second slotline, each of the vias extending through the substrate from the first conductive layer to the second conductive layer.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: September 5, 2023
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Gregory J. Wunsch, Christopher K. Cheung, Christopher R. Stroili
  • SLOT ANTENNA ASSEMBLY WITH TAPERED FEEDLINES AND SHAPED APERTURE
    Publication number: 20220149529
    Abstract: A slot antenna includes a substrate having a first side and a second side, a first conductive layer on the first side of the substrate, and a second conductive layer on the second side of the substrate. A first aperture is in the first conductive layer, a second aperture is in the first conductive layer, a first slotline is in the first conductive layer and in communication with the first aperture, and a second slotline is in the first conductive layer and in communication with the second aperture. A third aperture can be in the second conductive layer. A plurality of vias can be in the substrate and surrounding at least a portion of a region including the first aperture, the second aperture, the first slotline, and the second slotline, each of the vias extending through the substrate from the first conductive layer to the second conductive layer.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 12, 2022
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Gregory J. Wunsch, Christopher K. Cheung, Christopher R. Stroili