Abstract: Embodiments relate to manipulating and controlling the magnetic field profile of a magnetron within a sputtering system dynamically (i.e., in real time), to most effectively utilize the target material as required by any stage of its erosion and to sputter deposit films with a desired profile or characteristics. In particular, embodiments relate to dynamic positional and rotational control of the magnetron or individual elements of the magnetron to alter the magnetic field profile of the magnetron during deposition.

Abstract: A method for constructing a permanent magnet assembly by using a non-magnetic frame between individual magnet segments to restrain the movement of the magnet segments. The frame restricts the movement of the magnets during assembly. The frame also provides an effective system for replacing magnets in the existing assembly.