Abstract: Systems and methods are provided for dynamically optimizing query execution in distributed computing environments. The method may begin by receiving and analyzing a query to determine complexity of the query, including generating an execution plan, assessing data volume, and identifying required operations. Based on this analysis, the system may estimate necessary computational resources. The system may then select an optimal execution environment by evaluating available resources and current workloads, or provision a new environment if needed. The system may then submit the query to the chosen environment, monitor the query during execution, and/or record performance statistics. This adaptive approach ensures efficient resource allocation and query processing, potentially improving performance and reducing costs in large-scale data processing systems.

Abstract: A cooling apparatus includes a flow equalizing manifold having hierarchical flow levels with descending and ascending passages dimensioned according to Bernoulli-based design relations to maintain substantially uniform flow conditions along prescribed streamlines. In certain embodiments, stepped or linear ceilings vary passage cross-section to regulate velocity/pressure at branch interfaces feeding a microchannel array. The manifold can implement forked symmetry or prescribed asymmetry, including different numbers/geometries/levels for inlets versus outlets and elevated vapor outlets for two-phase operation. In further embodiments, modular polygonal (hexagonal/diamond) flow units at a final level provide passive, spatially distributed flow metering/collection. The manifold and an associated finned plate may be additively manufactured and configured as modular, removably coupled components.

Abstract: A cooling apparatus includes a two?phase manifold, a finned plate with a microchannel array, and an interface between them. The manifold comprises hierarchical descending passages for liquid inflow and ascending passages for vapor and liquid outflow. Internal surfaces of vapor passages may include a hydrophobic composition and internal surfaces of liquid passages may comprise a hydrophilic composition to passively separate phases. The interface includes gas?permeable, liquid?resistant screens or barriers positioned at entrances of ascending vapor passages, and open areas aligned with descending and ascending liquid passages. A vapor outlet may be located at a higher elevation than a liquid outlet. The microchannel array can include divergent microchannels with regions coordinated to the interface.

Abstract: A cooling block including a flow manifold and a finned plate having a base plate and a microchannel array, and a cooling system including the cooling block are provided. The flow manifold is fabricated utilizing additive manufacturing and include a symmetric multiscale hierarchical flow routing structure designed and/or is fabricated with injection molding or configurable segmented sheet metal and includes a multiscale hierarchical flow routing structure designed to reduce or minimize or reduce pressure drop and thermal resistance. The flow manifold incudes a first level including first fluid passages open to an inlet, an output level including second fluid passages open to an outlet, and a second level including first fluid passages and second fluid passages. The cooling system further includes at least one pump and at least one heat exchanger in fluid communication with the flow manifold of the cooling block.

Abstract: A cooling apparatus including a flow manifold and a finned plate having a base plate and a microchannel array, and a cooling system including the cooling apparatus are provided. The flow manifold is fabricated utilizing additive manufacturing and includes a multiscale hierarchical flow routing structure defined with respect to a balancing reference designed to reduce or minimize pressure drop and thermal resistance. The flow manifold incudes a balancing reference, a first level including first fluid passages open to an inlet, an output level including second fluid passages open to an outlet, and a second level including first fluid passages and second fluid passages. A volume of the inlet and a volume of the outlet are substantially equal with respect to the balancing reference. The cooling system further includes at least one pump and at least one heat exchanger in fluid communication with the flow manifold of the cooling apparatus.

Abstract: A cooling apparatus includes a flow equalizing manifold having hierarchical flow levels with descending and ascending passages dimensioned according to Bernoulli-based design relations to maintain substantially uniform flow conditions along prescribed streamlines. In certain embodiments, stepped or linear ceilings vary passage cross-section to regulate velocity/pressure at branch interfaces feeding a microchannel array. The manifold can implement forked symmetry or prescribed asymmetry, including different numbers/geometries/levels for inlets versus outlets and elevated vapor outlets for two-phase operation. In further embodiments, modular polygonal (hexagonal/diamond) flow units at a final level provide passive, spatially distributed flow metering/collection. The manifold and an associated finned plate may be additively manufactured and configured as modular, removably coupled components.

Abstract: A cooling apparatus includes a two?phase manifold, a finned plate with a microchannel array, and an interface between them. The manifold comprises hierarchical descending passages for liquid inflow and ascending passages for vapor and liquid outflow. Internal surfaces of vapor passages may include a hydrophobic composition and internal surfaces of liquid passages may comprise a hydrophilic composition to passively separate phases. The interface includes gas?permeable, liquid?resistant screens or barriers positioned at entrances of ascending vapor passages, and open areas aligned with descending and ascending liquid passages. A vapor outlet may be located at a higher elevation than a liquid outlet. The microchannel array can include divergent microchannels with regions coordinated to the interface.

Abstract: A cooling apparatus includes a flow equalizing manifold having hierarchical flow levels with descending and ascending passages dimensioned according to Bernoulli-based design relations to maintain substantially uniform flow conditions along prescribed streamlines. In certain embodiments, stepped or linear ceilings vary passage cross-section to regulate velocity/pressure at branch interfaces feeding a microchannel array. The manifold can implement forked symmetry or prescribed asymmetry, including different numbers/geometries/levels for inlets versus outlets and elevated vapor outlets for two-phase operation. In further embodiments, modular polygonal (hexagonal/diamond) flow units at a final level provide passive, spatially distributed flow metering/collection. The manifold and an associated finned plate may be additively manufactured and configured as modular, removably coupled components.

Abstract: A three-dimensional heterogeneous integrated (3DHI) package includes: a plurality of electrically interconnected active layers stacked on each other and a cooling block at a lower end of the active layers. Each of the active layers includes a semiconductor element, and at least one of the active layers includes an embedded heat spreader. The cooling block has a plurality of cooling channels formed therein, and the cooling channels do not extend through any of the active layers.

Abstract: Systems and methods are provided for dynamically optimizing query execution in distributed computing environments. The method may begin by receiving and analyzing a query to determine complexity of the query, including generating an execution plan, assessing data volume, and identifying required operations. Based on this analysis, the system may estimate necessary computational resources. The system may then select an optimal execution environment by evaluating available resources and current workloads, or provision a new environment if needed. The system may then submit the query to the chosen environment, monitor the query during execution, and/or record performance statistics. This adaptive approach ensures efficient resource allocation and query processing, potentially improving performance and reducing costs in large-scale data processing systems.

Abstract: Systems and methods are provided for processing data for cloud-based data warehousing. The method may receive a request to insert a large amount of data items into a table of a cloud-based database. The method may create a plurality of temporary tables in the cloud-based database in response to the request. The method may divide the large amount of data items into a plurality of sets of data items. The method may insert each set of data items of the plurality of sets of data items into a corresponding temporary table of the plurality of temporary tables. The method may merge the plurality of temporary tables into the table of the cloud-based database.

Abstract: An yttrium-containing structure comprises: (a) a substrate layer comprising a metal alloy, a ceramic material, a ceramic composite, or a combination thereof; (b) a bond-coat layer disposed on the substrate layer, or on an optional interlayer that is on the substrate layer, wherein the bond-coat layer comprises yttrium and a noble metal selected from the group consisting of platinum, iridium, rhenium, ruthenium, rhodium, osmium, and/or palladium; (c) a thermally grown oxide layer disposed on the bond-coat layer, wherein the thermally grown oxide layer comprises yttrium oxide; and (d) optionally, a top-coat layer disposed on the thermally grown oxide layer, wherein the top-coat layer comprises a metal oxide, a metal pyrochlore, or a metal silicate. Yttrium may be replaced with lutetium, in which the bond-coat layer comprises lutetium and a noble metal (e.g., Pt or Ir). A mixture of yttrium and lutetium may also be employed.

Abstract: An imaging sensor package including: an imaging sensor; and a patterned substrate coupled to a surface of the imaging sensor. The imaging sensor and the patterned substrate being curved. The patterned substrate having a petal-shaped patterned area having a first thickness and a base substrate having a second thickness, the first thickness being greater than the second thickness.

Abstract: The disclosed ion trap comprises a plurality of structurally continuous blades and a plurality of recessed control electrodes, wherein the plurality of structurally continuous blades includes at least two structurally continuous RF blades and at least two structurally continuous DC blades, wherein the recessed control electrodes are disposed on or within the structurally continuous blades, and wherein the ion trap is in a ring configuration. The ion trap enables fast readout of optical transitions using stationary laser beams and moving ions. This design fundamentally contrasts with traditional linear Paul traps that employ stationary ions and laser beams that are turned on or off. Because the RF and DC blades are structurally continuous, the trapping potential is continuous and harmonic. Instead of segmenting the blades as conventionally, segmented recessed control electrodes are utilized to reduce voltage noise that causes unwanted heating of the ions. Many benefits and commercial uses are described.

Abstract: A radio frequency surface-aperture, including: a mechanical support structure configured for maintaining mechanical stiffness and strength at a selected temperature; thermal insulation having at least a single layer; one or more through-thickness waveguides located through a thickness of the mechanical support structure and thermal insulation; a cold-side mode coupler arranged to connect a designated cold side of the one or more through-thickness waveguides to an electronic subsystem device; and one or more surface-wave waveguides arranged as an RF antenna on a surface of the mechanical support structure in operative communication with the through-thickness waveguides.

Abstract: A radio frequency surface-aperture, including: a mechanical support structure configured for maintaining mechanical stiffness and strength at a selected temperature; thermal insulation having at least a single layer; one or more through-thickness waveguides located through a thickness of the mechanical support structure and thermal insulation; a cold-side mode coupler arranged to connect a designated cold side of the one or more through-thickness waveguides to an electronic subsystem device; and one or more surface-wave waveguides arranged as an RF antenna on a surface of the mechanical support structure in operative communication with the through-thickness waveguides.

Abstract: A radio frequency surface-aperture, including: a mechanical support structure configured for maintaining mechanical stiffness and strength at a selected temperature; thermal insulation having at least a single layer; one or more through-thickness waveguides located through a thickness of the mechanical support structure and thermal insulation; a cold-side mode coupler arranged to connect a designated cold side of the one or more through-thickness waveguides to an electronic subsystem device; and one or more surface-wave waveguides arranged as an RF antenna on a surface of the mechanical support structure in operative communication with the through-thickness waveguides.

Abstract: A three-dimensional heterogeneous integrated (3DHI) package includes: a plurality of electrically interconnected active layers stacked on each other and a cooling block at a lower end of the active layers. Each of the active layers includes a semiconductor element, and at least one of the active layers includes an embedded heat spreader. The cooling block has a plurality of cooling channels formed therein, and the cooling channels do not extend through any of the active layers.

Abstract: A microchannel cooling block includes: a base plate; a microchannel array including a plurality of thermally conductive plates connected to and extending from a surface of the base plate, the thermally conductive plates being aligned so that a highest or second highest thermally conductive axis thereof extends away from the surface of the base plate, adjacent ones of the thermally conductive plates being spaced apart from each other to form a plurality of microchannels between the thermally conductive plates, one of the microchannels being between each adjacent two of the thermally conductive plates; and a manifold connected to the thermally conductive plates, an interior of the manifold being in fluid communication with the microchannels in the microchannel array.

Abstract: An apparatus and related method are disclosed for compensation of an antenna and/or an antenna array located at a surface that experiences environmental conditions. The apparatus can include: an embedded compensation and/or calibration structure configured to be interrogated by an electromagnetic wave, to dynamically compensate for surface erosion, thermal expansion, and/or dielectric constant changes of a surface scattering antenna; and a processor configured to: receive measurements of the compensation and/or calibration structure to determine beam pointing for dynamically varying surface conditions and perform sensing and/or seeking observation.