Abstract: An improved electronic chassis for housing and cooling electronic modules. The electronic chassis includes a top and bottom which are connected by two sides, a front and a rear. The chassis includes an upper section near the top and within the top, bottom, front, rear and sides of the chassis, and the chassis includes a lower section near the bottom and within the top, bottom, front, rear and sides of the chassis. There are at least two electronic modules to be mounted in the chassis. There are at least two intake fans mounted in the upper section of the chassis at the back of the chassis. The intake fans are for intake of cooling air from outside the rear of the chassis. There are at least two bays mounted in the upper section of the chassis in front of the intake fans and near the front of the chassis. The bays are for receiving the electronic modules, where each of the bays have an open front and an open rear. The front of the bays are open to provide access to receive the electronic modules.

Abstract: An improved electronic chassis for housing and cooling electronic modules. The electronic chassis includes a top and bottom which are connected by two sides, a front and a rear. The chassis includes an upper section near the top and within the top, bottom, front, rear and sides of the chassis, and the chassis includes a lower section near the bottom and within the top, bottom, front, rear and sides of the chassis. There are at least two electronic modules to be mounted in the chassis. There are at least two intake fans mounted in the upper section of the chassis at the back of the chassis. The intake fans are for intake of cooling air from outside the rear of the chassis. There are at least two bays mounted in the upper section of the chassis in front of the intake fans and near the front of the chassis. The bays are for receiving the electronic modules, where each of the bays have an open front and an open rear. The front of the bays are open to provide access to receive the electronic modules.