Abstract: A magnet's N and S polarity can be alternately assembled within a MR sensor housing to determine the type of sensor that is assembled. In an MR sensor package including a housing having a sensing face and adapted for containing a sensing transducer and magnet, it can be determined if the MR sensor package is to be an X-type or Y-type sensor by testing the MR sensor package prior to labeling, shipping and/or use to determine its type by measuring the magnetic field emanating from the sensing face using a magnetic gauss probe. During assembly, the magnets N or S polarity is positioned to face the sensing face of the sensor to indicate the sensor type.

Abstract: A magnet's N and S polarity can be alternately assembled within a MR sensor housing to determine the type of sensor that is assembled. In an MR sensor package including a housing having a sensing face and adapted for containing a sensing transducer and magnet, it can be determined if the MR sensor package is to be an X-type or Y-type sensor by testing the MR sensor package prior to labeling, shipping and/or use to determine its type by measuring the magnetic field emanating from the sensing face using a magnetic gauss probe. During assembly, the magnets N or S polarity is positioned to face the sensing face of the sensor to indicate the sensor type.

Abstract: A development process of C4 bump pads is for advanced microelectronic integrated circuit connection technology. This approach involves the laying down of conductor lines on a substrate and an encapsulation over the lines, plus the making of openings for making the bump pads. The bump pads are for situating solder balls for connections with a flip chip or integrated circuit. The openings are made by application of a diffusing material that is patterned on the glass encapsulation to define the areas of the bump pads. After the material is dried and diffused into the encapsulation layer, the diffused material is washed out with water to leave open areas for the bump pads. Then solder balls may be placed on the bump pads and heated to adhere to the conductor lines and form rounded bumps on the respective pads. Flux may then be applied to the solder bumps, and the flip chip is placed with its terminals on the solder bumps which are heated for connection.