Abstract: An “H layout” according to the present invention affords for a smaller, simpler, less expensive and higher performance midplane for use in a communication system for connecting various modules together. The layout is based on the concept of symmetry around a mid-section, which allows for the reuse of APM cards on the top and bottom of a midplane. All high-speed tracks on the midplane are concentrated in the center thereof. Front and back connectors on the midplane are staggered so as to permit very high module densities while maintaining manageable finger access. The present invention has the advantages of: reducing high-speed track lengths in a backplane or midplane; simplifying high speed track routing by having almost only horizontal tracks on the midplane, thus reducing crossing over; and providing a smaller midplane, thus reducing costs.

Abstract: An “H layout” according to the present invention affords for a smaller, simpler, less expensive and higher performance midplane for use in a communication system for connecting various modules together. The layout is based on the concept of symmetry around a mid-section, which allows for the reuse of APM cards on the top and bottom of a midplane. All high-speed tracks on the midplane are concentrated in the center thereof. Front and back connectors on the midplane are staggered so as to permit very high module densities while maintaining manageable finger access. The present invention has the advantages of: reducing high-speed track lengths in a backplane or midplane; simplifying high speed track routing by having almost only horizontal tracks on the midplane, thus reducing crossing over; and providing a smaller midplane, thus reducing costs.