Abstract: A method is provided. The method may include engaging a first edge region on a first surface of a substrate with a first support roller; engaging a second edge region on the first surface of the substrate with a second support roller; transporting the substrate over the first and the second support rollers; repeating the following sequence of steps to form a thin film on the substrate: (a) exposing the substrate to a first precursor; (b) supplying a reactive species to the substrate after exposing the substrate to the first precursor; and depositing a vapor on the thin film to form a coating on the thin film.

Abstract: A barrier film. The barrier film may include a substrate, an inorganic layer disposed on a side of the substrate, and an organic layer-by-layer structure disposed on a side of the inorganic layer, where in the organic layer-by-layer structure comprises a layer of a cationic polyelectrolyte and a layer of an anionic polyelectrolyte.

Abstract: There is provided a barrier film including a barrier layer having two opposing major surfaces, a first organic layer in direct contact with one of the opposing major surfaces of the barrier layer; a second organic layer in direct contact with the other of the opposing major surfaces of the barrier layer; and a substrate in direct contact with the first organic layer or the second organic layer; wherein the barrier layer comprises buckling deformations with average spacing smaller than average spacing of the buckling deformations in the first or second organic layer.

Abstract: There is provided a barrier film including a barrier layer having two opposing major surfaces, wherein the barrier layer comprise buckling deformations and non-buckling regions; a first organic layer in direct contact with one of the opposing major surfaces of the barrier layer; a second organic layer in direct contact with the other of the opposing major surfaces of the barrier layer; and a substrate in direct contact with the first organic layer or the second organic layer.

Abstract: Barrier assemblies including ultrathin barrier laminates and methods of making the barrier assemblies are provided. A barrier assembly includes a thermoplastic polymer skin layer having opposite first and second major surfaces, and a barrier stack coated on the first major surface of the thermoplastic polymer skin layer to form an integral protective layer having a thickness no greater than about 0.5 mil (about 12.7 microns). The removable carrier film has a major surface releasably attached to the second major surface of the thermoplastic polymer skin layer. In some cases, the removal of the carrier film results in ultrathin barrier laminates.

Abstract: Multilayer constructions are provided, for instance including a barrier layer, a sealing layer, and a polymer layer. The barrier layer has a major surface on which the sealing layer is disposed, and the sealing layer includes crosslinked silsesquioxane. The polymer layer includes a crosslinked polymer, and is disposed adjacent to a major surface of the barrier layer opposite from the sealing layer. The multilayer construction may further include additional layers, such as a substrate. Devices are also provided including the multilayer constructions.

Abstract: Multilayer barrier films and methods of making the films are provided. The films include a smooth layer and a barrier layer directly disposed on the smooth layer. In some cases, the smooth layer includes a thiol-ene material as a polymeric matrix material. In some cases, the films have a sandwich structure of barrier layer/smooth layer/substrate/smooth layer/barrier layer.

Abstract: Multilayer barrier films and methods of making the films are provided. The films include a smooth layer and a barrier layer directly disposed on the smooth layer. In some cases, the smooth layer includes a thiol-ene material as a polymeric matrix material. In some cases, the films have a sandwich structure of barrier layer/smooth layer/substrate/smooth layer/barrier layer.

Abstract: A composite article includes a multilayer barrier assembly bonded to a substrate, and a top polymer layer bonded to the multilayer barrier assembly opposite the substrate. The multilayer barrier assembly comprises a base polymer layer, and a base inorganic barrier layer. The base polymer layer comprises a polymerized reaction product of polymerizable components comprising at least one di(meth)acrylate represented by the formula. Each R1 independently represents H or methyl; R2 and R3 independently represent an alkyl group having from 1 to 4 carbon atoms or R2 and R3 may together form an alkylene group having from 2 to 7 carbon atoms; and R4 represents an alkyl group having from 1 to 12 carbon atoms. Methods of making the same are also disclosed.

Abstract: A composite article comprises a substrate, base polymer layer, an inorganic barrier layer, and top polymer layer. The base polymer layer is disposed on the substrate, and includes a polymerized reaction product of components comprising at least 60 percent by weight of at least one di(meth)acrylate represented by the formula wherein: each R1 is independently H or methyl; and each R2 independently represents an alkyl group having from 1 to 4 carbon atoms, or two R2 groups may together form an alkylene group having from 2 to 7 carbon atoms. An inorganic barrier layer is bonded to the base polymer layer. The top polymer layer is disposed on the inorganic barrier layer opposite the substrate, wherein the top polymer layer comprises a polymerized reaction product of components comprising at least 60 percent by weight of a cycloaliphatic (meth)acrylate having from 13 to 24 carbon atoms.

Abstract: A composite article includes a multilayer barrier assembly bonded to a substrate, and a top polymer layer bonded to the multilayer barrier assembly opposite the substrate. The multilayer barrier assembly comprises a base polymer layer and a base inorganic barrier layer. The base polymer layer comprises a polymerized reaction product of polymerizable components comprising at least one di(meth)acrylate represented by the formula: Formula (I) Each R1 independently represents H or methyl; each R2 independently represents an alkyl group having from 1 to 4 carbon atoms; x=0, 1, 2, 3, or 4; and z=0, 1, 2, 3, or 4, with the provisos that at least one of x and z is not zero and 1?x+z?4. Methods of making the same are also disclosed.

Abstract: Urea (multi)-(meth)acrylate (multi)-silane precursor compounds, synthesized by reaction of (meth)acrylated materials having isocyanate functionality with aminosilane compounds, either neat or in a solvent, and optionally with a catalyst, such as a tin compound, to accelerate the reaction. Also described are articles including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer; and a protective (co)polymer layer on the oxide layer, the protective (co)polymer layer including the reaction product of at least one urea (multi)-(meth)acrylate (multi)-silane precursor compound synthesized by reaction of (meth)acrylated materials having isocyanate functionality with aminosilane compounds. The substrate may be a (co)polymer film or an electronic device such as an organic light emitting device, electrophoretic light emitting device, liquid crystal display, thin film transistor, or combination thereof.

Abstract: Diurethane (meth)acrylate-silane precursor compounds prepared by reacting a primary or secondary aminosilane with a cyclic carbonate to yield a hydroxylalkylene-carbamoylalkylene-alkoxysilanes (referred to as a “hydroxylcarbamoylsilane”), which is reacted with a (meth)acrylated material having isocyanate functionality, either neat or in solvent, and optionally with a catalyst, such as a tin compound. Also described are articles including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer; and a protective (co)polymer layer on the oxide layer, the protective (co)polymer layer including the reaction product of at least one diurethane (meth)acrylate-silane precursor compound. The substrate may be a (co)polymer film or an electronic device such as an organic light emitting device, electrophoretic light emitting device, liquid crystal display, thin film transistor, or combination thereof.

Abstract: There is provided a barrier film having a substrate, a low thermal conductivity organic layer and an inorganic stack. The inorganic stack will include a low thermal conductivity non-metallic inorganic material layer and a high thermal conductivity metallic material layer.

Abstract: Urea (multi)-(meth)acrylate (multi)-silane precursor compounds, synthesized by reaction of (meth)acrylated materials having isocyanate functionality with aminosilane compounds, either neat or in a solvent, and optionally with a catalyst, such as a tin compound, to accelerate the reaction. Also described are articles including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer; and a protective (co)polymer layer on the oxide layer, the protective (co)polymer layer including the reaction product of at least one urea (multi) (meth)acrylate (multi)-silane precursor compound synthesized by reaction of (meth)acrylated materials having isocyanate functionality with aminosilane compounds. The substrate may be a (co)polymer film or an electronic device such as an organic light emitting device, electrophoretic light emitting device, liquid crystal display, thin film transistor, or combination thereof.

Abstract: Discontinuous coatings and methods of forming such coatings including transiting a substrate through a vaporization area, providing a reactant vapor comprising at least one vaporized monomer or oligomer to the vaporization area, and chemically reacting the at least one vaporized monomer or oligomer to form a discontinuous layer on the substrate, optionally wherein chemically reacting further includes polymerization. The discontinuous layer may be a patterned, semi-patterned, or random discontinuous layer.

Abstract: Compositions of matter described as urea (multi)-urethane (meth)acrylate-silanes having the general formula RA—NH—C(O)—N(R4)—R11—[O—C(O)NH—RS]n, or RS—NH—C(O)—N(R4)—R11—[O—C(O)NH—RA]n. Also described are articles including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer; and a protective (co)polymer layer on the oxide layer, the protective (co)polymer layer including the reaction product of at least one urea (multi)-urethane (meth)acrylate-silane precursor compound. The substrate may be a (co)polymer film or an electronic device such as an organic light emitting device, electrophoretic light emitting device, liquid crystal display, thin film transistor, or combination thereof. Methods of making such urea (multi)-urethane (meth)acrylate-silane precursor compounds, and their use in composite films and electronic devices are also described.

Abstract: Urethane (multi)-(meth)acrylate (multi)-silane compositions, and articles including a (co)polymer reaction product of at least one urethane (multi)-(meth)acrylate (multi)-silane precursor compound. The disclosure also articles including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer; and a protective (co)polymer layer on the oxide layer, the protective (co)polymer layer including the reaction product of at least one urethane (multi) (meth)acrylate (multi)-silane precursor compound. The substrate may be a (co)polymeric film or an electronic device such as an organic light emitting device, electrophoretic light emitting device, liquid crystal display, thin film transistor, or combination thereof. Methods of making urethane (multi)-(meth)acrylate (multi)-silane precursor compounds and their use in composite multilayer barrier films are also described.

Abstract: There is provided a vacuum insulation panel envelope having a substrate, a low thermal conductivity organic layer and a low thermal conductivity inorganic stack. The low thermal conductivity inorganic stack will include low thermal conductivity non-metallic inorganic materials and/or low thermal conductivity metallic materials.

Abstract: A method for forming an inorganic or hybrid organic/inorganic barrier layer on a substrate, comprising condensing a vaporized metal alkoxide to form a layer atop the substrate, and contacting the condensed metal alkoxide layer with water to cure the layer is provided.