Abstract: A plurality of approaches for forming a semiconductor device using an adaptive patterning method is disclosed. Some approaches include placing a semiconductor die unit on a carrier element, calculating trace geometry for a second set of traces, constructing a prestratum comprising a first set of traces, and constructing the second set of traces according to the calculated trace geometry. Forming the semiconductor device may further include electrically connecting at least one of the first set of traces to at least one of the second set of traces, and electrically connecting at least one bond pad of the semiconductor die unit to a destination pad through the at least one of the first set of traces and the at least one of the second set of traces.

Abstract: A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for encapsulating portions of the electronic component and the first surface of the substrate, wherein a portion of the mold compound is removed around at least one side of the electronic component. A conductive coating is applied to the mold compound and an area where the portion of the mold compound is removed.

Abstract: One can treat a viral infection such as hepatitis B (HBV), hepatitis C(HCV), and bovine viral diarrhea virus (BVDV) infections via the delivery of pH sensitive liposomes directly into the endoplasmic reticulum (ER) membrane. Two exemplary liposome formulations are DOPE/CHEMS (DC liposomes) and DOPE/CHEMS/PEG-PE (DCPP liposomes). DC and DCPP liposomes can optimize the intracellular delivery of N-butyl deoxynojirimycin (NB-DNJ), and consequently increase the in vivo activity of this iminosugar several orders of magnitude, and could be used in combination with other therapeutic agents such as interferon and/or ribavirin. The optimized release of NB-DNJ directly into the ER can be also applied for the treatment of other viruses, for which NB-DNJ is known to be an effective antiviral, such as human immunodeficiency virus (HIV).

Abstract: Disclosed are compositions and methods useful for inducing an immunogenic response in a subject or host. In particular, the compositions and methods may be directed to carbohydrate HIV vaccines and to methods of producing a carbohydrate HIV vaccine by introducing antigenic sugars into mimics of the glycans of the HIV envelope glycoproteins gp120 and gp41.

Abstract: Methods of producing a carbohydrate HIV vaccine or immunogenic composition are provided. One method comprises expressing a glycoprotein with a modified glycosylation, which facilitates binding of the glycoprotein to the 2G12 antibody. Another method comprises iteratively selecting cells with a high affinity for the 2G12 antibody.

Abstract: The present invention provides the use of an inhibitor of glycolipid biosynthesis in the manufacture of a medicament for the treatment of a glycolipid-mediated autoimmune disease.

Abstract: Disclosed are compositions and methods useful for inducing an immunogenic response in a subject or host. In particular, the compositions and methods may be directed to carbohydrate HIV vaccines and to methods of producing a carbohydrate HIV vaccine by introducing antigenic sugars into mimics of the glycans of the HIV envelope glycoproteins gp120 and gp41.

Abstract: One can treat a viral infection such as hepatitis B (HBV), hepatitis C (HCV), and bovine viral diarrhea virus (BVDV) infections via the delivery of pH sensitive liposomes directly into the endoplasmic reticulum (ER) membrane. Two exemplary liposome formulations are DOPE/CHEMS (DC liposomes) and DOPE/CHEMS/PEG-PE (DCPP liposomes). DC and DCPP liposomes can optimize the intracellular delivery of N-butyl deoxynojirimycin (NB-DNJ), and consequently increase the in vivo activity of this iminosugar several orders of magnitude, and could be used in combination with other therapeutic agents such as interferon and/or ribavirin. The optimized release of NB-DNJ directly into the ER can be also applied for the treatment of other viruses, for which NB-DNJ is known to be an effective antiviral, such as human immunodeficiency virus (HIV).

Abstract: There is provided a process for increasing the yellowness of polyester polymer particles, preforms, bottles, and concentrates, containing a polyester polymer such as polyethylene terephthalate and copolymers by adding a yellow colorant and reheat agent particles comprising titanium, alloys of titanium, titanium nitride, titanium boride, titanium carbide, or combinations thereof to a melt phase polymerization process for making the polyester polymer to adding any one of the colorant or particles to a polyester polymer.

Abstract: Crystallizable polyester compositions containing an aliphatic polyamide crystallization nucleator exhibit controllable and adjustable crystallization rates upon cooling from the melt and are thermoformable in melt to mold processes.

Abstract: Methods of producing a carbohydrate HIV vaccine or immunogenic composition are provided. One method comprises expressing a glycoprotein with a modified glycosylation, which facilitates binding of the glycoprotein to the 2G12 antibody. Another method comprises iteratively selecting cells with a high affinity for the 2G12 antibody.

Abstract: A package includes both a flip chip mounted active chip component and a passive chip component. To form the package, a solder paste is screened onto a passive chip component contact on an upper surface of a substrate. A terminal of the passive chip component is aligned with the solder paste. The solder paste is melted to form a solder joint between the passive chip component contact and the terminal. Solder flux residue from the solder paste is removed. A solder bump is formed on a bond pad of an active chip component. The solder bump is aligned with an active chip component contact on the upper surface of the substrate. The solder bump is melted to form a bump between the active chip component contact and the bond pad, wherein the solder joint does not melt during the melting of the solder bump.

Abstract: Organic solderability protectant (OSP) is applied to copper bond pads. The copper bond pads include flip chip bond pads and SMD bond pads on a dielectric upper surface and BGA bond pads on a dielectric lower surface. Solder paste is applied to the flip chip bond pads. This solder paste is reflowed in an inert atmosphere to form solder-on-pads (SOPs) on the flip chip bond pads. Flux residue from the solder paste is then removed with water. By reflowing the solder paste in an inert atmosphere and removing the flux residue with water, degradation of the OSP and oxidation of the SMD and BGA bond pads is inhibited.

Abstract: A substrate includes a flip chip bond pad and a first bond pad on a dielectric substrate layer. First and second organic solderability protectant (OSP) layers are on the flip chip bond and first bond pad, respectively. A solder paste is on the first OSP layer. The solder paste is reflowed in an inert atmosphere to form a solder-on-pad (SOP) directly on and in contact with the flip chip bond pad. A sufficient thickness of the second OSP layer remains after reflow to inhibit oxidation of the first bond pad.

Abstract: A package includes both a flip chip mounted active Chip component and a passive chip component. The flip chip bumps between the bond pads of the active chip component and the substrate are low impedance. Further, by mounting the active chip component as a flip chip, the area on the substrate occupied by the active chip component is approximately equal to the area of the active chip component.