Patents by Inventor Christopher Seay

Christopher Seay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High dielectric constant neat polymeric film
    Patent number: 12698370
    Abstract: A polymeric film and process for making same, the film comprising residues of 5(6)-amino-2-(p-aminophenyl) benzimidazole, aromatic diamine, and aromatic diacid-chloride, in the form of polymer having a polymer chain including a salt of formula I, wherein C+ is a sodium, potassium, or calcium cation, the film having a thickness of about 1 to 50 micrometers, and a dielectric constant of 4.5 or greater at 2 GHz in the absence of any particulate additives that increase the dielectric constant of the film.
    Type: Grant
    Filed: September 14, 2023
    Date of Patent: August 4, 2026
    Assignee: DUPONT SAFETY & CONSTRUCTION, INC.
    Inventors: Kathleen Opper, Christopher Seay, Kevin Kaurich, Jacob Pretko
  • High tenacity filled films comprising a polymer having imidazole groups
    Patent number: 12577369
    Abstract: A filled polymeric film comprising polymer and an inorganic dielectric constant-enhancing additive, the filled polymeric film having 12 to 75 percent by weight of said inorganic dielectric constant-enhancing additive, based on the total weight of the polymer and said inorganic constant-enhancing additive in the filled polymeric film; wherein the polymer comprises imidazole groups; and wherein the filled polymeric film has a filled film tenacity that is 70 to 100 percent of a neat film tenacity of a polymeric film having the same thickness made from the same polymer but without the said inorganic dielectric constant-enhancing additive.
    Type: Grant
    Filed: September 15, 2023
    Date of Patent: March 17, 2026
    Assignee: DUPONT SAFETY & CONSTRUCTION, INC.
    Inventors: Kathleen Opper, Christopher Seay, Kevin Kaurich
  • HIGH DIELECTRIC CONSTANT NEAT POLYMERIC FILM
    Publication number: 20240117131
    Abstract: A polymeric film and process for making same, the film comprising residues of 5(6)-amino-2-(p-aminophenyl) benzimidazole, aromatic diamine, and aromatic diacid-chloride, in the form of polymer having a polymer chain including a salt of formula I, wherein C+ is a sodium, potassium, or calcium cation, the film having a thickness of about 1 to 50 micrometers, and a dielectric constant of 4.5 or greater at 2 GHz in the absence of any particulate additives that increase the dielectric constant of the film.
    Type: Application
    Filed: September 14, 2023
    Publication date: April 11, 2024
    Inventors: Kathleen Opper, Christopher Seay, Kevin Kaurich, Jacob Pretko
  • HIGH TENACITY FILLED FILMS COMPRISING A POLYMER HAVING IMIDAZOLE GROUPS
    Publication number: 20240110036
    Abstract: A filled polymeric film comprising polymer and an inorganic dielectric constant-enhancing additive, the filled polymeric film having 12 to 75 percent by weight of said inorganic dielectric constant-enhancing additive, based on the total weight of the polymer and said inorganic constant-enhancing additive in the filled polymeric film; wherein the polymer comprises imidazole groups; and wherein the filled polymeric film has a filled film tenacity that is 70 to 100 percent of a neat film tenacity of a polymeric film having the same thickness made from the same polymer but without the said inorganic dielectric constant-enhancing additive.
    Type: Application
    Filed: September 15, 2023
    Publication date: April 4, 2024
    Inventors: Kathleen Opper, Christopher Seay, Kevin Kaurich