Patents by Inventor Christopher SEIBERT

Christopher SEIBERT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12216158
    Abstract: Systems and methods for testing a photonic IC (PIC) with an optical probe having an out-of-plane edge coupler to convey test signals between the out-of-plane probe and an edge coupled photonic waveguide within a plane of the PIC. To accommodate dimensions of the optical probe, a test trench may be fabricated in the PIC near an edge coupler of the waveguide. The optical probe may be displaced along one or more axes relative to a prober to position a free end of the prober within the test trench and to align the probe's out-of-plane edge coupler with an edge coupler of a PIC waveguide. Accordingly, a PIC may be probed at the wafer-level, without first dicing a wafer into PIC chips or bars. The optical probe may be physically coupled to a prober through a contact sensor to detect and/or avoid physical contact between probe and PIC.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: February 4, 2025
    Assignee: Intel Corporation
    Inventors: Jeremy Hicks, Hari Mahalingam, Christopher Seibert, Eric Snow, Harel Frish
  • Publication number: 20220163583
    Abstract: Systems and methods for testing a photonic IC (PIC) with an optical probe having an out-of-plane edge coupler to convey test signals between the out-of-plane probe and an edge coupled photonic waveguide within a plane of the PIC. To accommodate dimensions of the optical probe, a test trench may be fabricated in the PIC near an edge coupler of the waveguide. The optical probe may be displaced along one or more axes relative to a prober to position a free end of the prober within the test trench and to align the probe's out-of-plane edge coupler with an edge coupler of a PIC waveguide. Accordingly, a PIC may be probed at the wafer-level, without first dicing a wafer into PIC chips or bars. The optical probe may be physically coupled to a prober through a contact sensor to detect and/or avoid physical contact between probe and PIC.
    Type: Application
    Filed: November 24, 2020
    Publication date: May 26, 2022
    Applicant: Intel Corporation
    Inventors: Jeremy Hicks, Hari Mahalingam, Christopher Seibert, Eric Snow, Harel Frish
  • Publication number: 20220107472
    Abstract: An apparatus includes an aperture disposed through an outer layer, a folding prism adjacent to the aperture, and a multi-mode optical fiber on which the folding prism is disposed. The aperture and the folding prism are insertable into a trench disposed through a waveguide of an edge emitting integrated laser, the aperture is configured to allow a light beam that is emitted by the waveguide, through the aperture, and the folding prism is configured to redirect the allowed light beam to the multi-mode optical fiber.
    Type: Application
    Filed: December 17, 2021
    Publication date: April 7, 2022
    Inventors: Alexander KRICHEVSKY, Christopher SEIBERT, David GOLD, Hari MAHALINGAM, Jonathan DOYLEND