Patents by Inventor Christopher Severance

Christopher Severance has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8758892
    Abstract: A compressible, thermally conductive foam interface pad is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. An assembly including the foam interface pad and the opposed electronic components is also provided.
    Type: Grant
    Filed: May 5, 2010
    Date of Patent: June 24, 2014
    Assignee: Parker Hannifin Corporation
    Inventors: Jonathan Bergin, Victoria Santa Fe, Christopher Severance, Gary Rosa
  • Publication number: 20120048528
    Abstract: A compressible, thermally conductive foam interface pad is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. An assembly including the foam interface pad and the opposed electronic components is also provided.
    Type: Application
    Filed: May 5, 2010
    Publication date: March 1, 2012
    Applicant: Parker Hannifin Corporation
    Inventors: Jonathan Bergin, Victoria Santa Fe, Christopher Severance, Gary Rosa
  • Publication number: 20070056769
    Abstract: An EMI shielding material is provided for making EMI shielding gaskets, coating and other articles. The EMI shielding material includes a non-conductive polymer, an inherently conductive polymer and a conductive metal powder. These components are intimately combined to prepare EMI shielding materials having superior electrical and mechanical performance when used in applications such as housings for electronic components.
    Type: Application
    Filed: September 12, 2006
    Publication date: March 15, 2007
    Inventors: Christopher Severance, Douglas Nobbs, John Reynolds